Circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11212922-B2
Application number	US-201916767870-A
Country	US
Kind code	B2
Filing date	Apr 23, 2019
Priority date	Apr 23, 2019
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

First claim

What is claimed is:

1. A circuit board manufacturing method comprising:
providing
(1) providing a substrate, and making a hole in the substrate to form a through hole;
(2) filling the through hole with a conductor to form a conductive hole;
(3) providing a peelable film to cover one side of the substrate;
(4) forming a groove in the peelable film and the substrate by laser ablation, the groove comprising a concave portion, the concave portion located at the conductive hole, and a diameter of the concave portion being larger than a diameter of the conductive hole to expose a portion of the conductor;
(5) performing a surface treatment on a side wall and a bottom wall of the groove to improve roughness;
(6) removing the peelable film;
(7) forming a seed layer on the side wall and the bottom wall of the groove;
(8) making a circuit layer in the groove to obtain a circuit board unit, the circuit layer comprising a connection pad located in the concave portion, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor;
(9) repeating step (1) to step (8) at least once; and
(10) laminating at least two of the circuit board units.

2. The circuit board manufacturing method according to claim 1 , wherein: in step (5), the side wall and the bottom wall of the groove are processed by a plasma surface treatment machine.

3. The circuit board manufacturing method according to claim 1 , wherein: in step (7), the seed layer is formed by chemical vapor deposition or physical vapor deposition.

4. The circuit board manufacturing method according to claim 1 , wherein: after step (8) and before step (9), the method further comprises a step of forming a metallization layer on a surface of the circuit layer.

5. The circuit board manufacturing method according to claim 1 , wherein: in step (1), one side of the substrate is connected to a carrier board through a separable film.

Assignees

• Qing Ding Prec Electronics Huaian Co Ltd
• Avary Holding Shenzhen Co Ltd

Inventors

• Ho Ming-Jaan
• Hu xian-qin
• Shen Fu-Yun
• Hsu Hsiao-Ting
• Wei yong-chao

Classifications

• H05K2201/0394

  Conductor crossing over a hole in the substrate or a gap between two separate substrate parts · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K3/0035

  of blind holes, i.e. having a metal layer at the bottom · CPC title