Semiconductor device having stacked chips
US-2026011692-A1 · Jan 8, 2026 · US
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Subject matter not provided for in other groups of this subclass
Subject matter not provided for in other groups of this subclass · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H03K99/00 |
| Official title | Subject matter not provided for in other groups of this subclass |
| Display label | Subject matter not provided for in other groups of this subclass |
| Total patents | 17 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 3 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 2 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device having stacked chips
US-12381183-B2 · Aug 5, 2025 · US
Semiconductor device having stacked chips
US-2021210467-A1 · Jul 8, 2021 · US
Semiconductor device having stacked chips
US-10985141-B2 · Apr 20, 2021 · US
Semiconductor device having stacked chips
US-2020144225-A1 · May 7, 2020 · US
Semiconductor device having stacked chips
US-10541231-B2 · Jan 21, 2020 · US
Semiconductor device having stacked chips
US-2019096854-A1 · Mar 28, 2019 · US
Semiconductor device having stacked chips
US-10157894-B2 · Dec 18, 2018 · US
Facilitating dynamic pipelining of workload executions on graphics processing units on computing devices
US-10068306-B2 · Sep 4, 2018 · US
Semiconductor device having stacked chips
US-2018076180-A1 · Mar 15, 2018 · US
Semiconductor device having stacked chips
US-9853013-B2 · Dec 26, 2017 · US
Method and circuit configuration for determining position minus time
US-9602109-B2 · Mar 21, 2017 · US
Semiconductor device having stacked chips
US-2016351547-A1 · Dec 1, 2016 · US
Semiconductor device having stacked chips
US-9431322-B2 · Aug 30, 2016 · US
Facilitating dynamic pipelining of workload executions on graphics processing units on computing devices
US-2016180486-A1 · Jun 23, 2016 · US
Semiconductor device having stacked chips
US-2015078085-A1 · Mar 19, 2015 · US
Semiconductor device having stacked chips
US-8928399-B2 · Jan 6, 2015 · US