Waveguide assembly for use with launcher-in-package devices
US-2026011902-A1 · Jan 8, 2026 · US
built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01P3/18 |
| Official title | built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers |
| Display label | built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers |
| Total patents | 61 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 3 |
| 2017 | 5 |
| 2018 | 5 |
| 2019 | 7 |
| 2020 | 8 |
| 2021 | 7 |
| 2022 | 6 |
| 2023 | 8 |
| 2024 | 1 |
| 2025 | 7 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Waveguide components of waveguides formed with additive manufacturing
US-12512574-B2 · Dec 30, 2025 · US
Flexible printed circuit cable
US-2025338395-A1 · Oct 30, 2025 · US
Electronic device
US-2025286260-A1 · Sep 11, 2025 · US
High efficiency far-field millimeter wave-based wireless power transfer system using cu/co metaconductor
US-2025239888-A1 · Jul 24, 2025 · US
Electronic device comprising first and second metal patterns arranged with first and second insulating patterns in a specified configuration
US-12368222-B2 · Jul 22, 2025 · US
Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials
US-12272855-B2 · Apr 8, 2025 · US
Gap waveguide antenna structure and electronic device
US-12249762-B2 · Mar 11, 2025 · US
Low loss transmission line comprising a signal conductor and return conductors having corresponding curved arrangements
US-11888204-B2 · Jan 30, 2024 · US
Low loss transmission line with stepped structures
US-2023361443-A1 · Nov 9, 2023 · US
Semiconductor device including transmission lines and method of forming the same
US-2023307813-A1 · Sep 28, 2023 · US
Waveguide structure
US-11764451-B2 · Sep 19, 2023 · US
Waveguide Components of Waveguides Formed with Additive Manufacturing
US-2023216170-A1 · Jul 6, 2023 · US
Electronic device
US-2023170603-A1 · Jun 1, 2023 · US
Gap waveguide antenna structure and electronic device
US-2023170622-A1 · Jun 1, 2023 · US
Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines
US-11664566-B2 · May 30, 2023 · US
Surface mountable microstrip line coupler having a coupling factor that is greater than −30dB at 28 GHz
US-11652265-B2 · May 16, 2023 · US
Circuit structure
US-11469484-B2 · Oct 11, 2022 · US
Transmission line cable including an unbendable superimposed layer part and a bendable non-superimposed layer part
US-11374299-B2 · Jun 28, 2022 · US
Free-form dual dual-conductor integrated radio frequency media
US-11342647-B2 · May 24, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01P3/18?
- CPC H01P3/18 is the Cooperative Patent Classification code for “built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers.”
- How many patents are filed under CPC H01P3/18 (built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers)?
- Our database includes 61 publications tagged with this CPC code.
- Is patent activity under CPC H01P3/18 growing?
- Publication counts under this code: 1 in 2024 vs 7 in 2025 (latest complete years).