Electronic device comprising first and second metal patterns arranged with first and second insulating patterns in a specified configuration

Patent metadata

Field	Value
Publication number	US-12368222-B2
Application number	US-202217975566-A
Country	US
Kind code	B2
Filing date	Oct 27, 2022
Priority date	Nov 26, 2021
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate;
a first metal pattern disposed on the substrate;
a first insulating pattern disposed on the first metal pattern;
a second insulating pattern, wherein in a cross-sectional view, the second insulating pattern is disposed on the first metal pattern and is adjacent to the first insulating pattern; and
a second metal pattern comprising a first contact portion, a second contact portion and a third contact portion, and disposed on the first metal pattern, the first insulating pattern and the second insulating pattern,
wherein in the cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion,
wherein the third contact portion is located between the first insulating pattern and the second insulating pattern in the cross-sectional view.

2. The electronic device according to claim 1 , wherein the first metal pattern has a first skin depth and the second metal pattern has a second skin depth, and wherein a thickness of the first metal pattern is greater than or equal to the first skin depth and a thickness of the second metal pattern is greater than or equal to the second skin depth in the cross-sectional view.

3. The electronic device according to claim 2 , wherein a width of the first contact portion in a first direction and a width of the second contact portion in the first direction are greater than or equal to a greater one of the first skin depth and the second skin depth.

4. The electronic device according to claim 1 , wherein an edge of the second metal pattern is recessed from an edge of the first metal pattern in the cross-sectional view.

5. The electronic device according to claim 1 , wherein an edge of the second metal pattern is aligned with an edge of the first metal pattern in the cross-sectional view.

6. The electronic device according to claim 1 , wherein an edge of the second metal pattern exceeds an edge of the first metal pattern in the cross-sectional view.

7. The electronic device according to claim 1 , further comprising:
a third insulating pattern disposed on the second metal pattern; and
a third metal pattern disposed on the third insulating pattern.

8. The electronic device according to claim 7 , wherein the third metal pattern has a third thickness greater than or equal to a third skin depth of the third metal pattern.

9. The electronic device according to claim 7 , wherein the third metal pattern is in contact with at least one of the first metal pattern and the second metal pattern.

10. The electronic device according to claim 1 , wherein the second insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion in the cross-sectional view.

11. An electronic device comprising:
a substrate;
a first metal pattern disposed on the substrate;
a first insulating pattern disposed on the first metal pattern; and
a second metal pattern comprising a first contact portion and a second contact portion, and disposed on the first metal pattern and the first insulating pattern,
wherein in a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion,
wherein in the cross-sectional view, an edge of the second metal pattern is recessed from an edge of the first metal pattern or exceeds the edge of the first metal pattern.

12. An electronic device comprising:
a substrate;
a first metal pattern disposed on the substrate and having a first skin depth; and
a second metal pattern comprising a first contact portion and a second contact portion, disposed on the first metal pattern and having a second skin depth,
wherein in a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and at least one of a width of the first contact portion in a first direction and a width of the second contact portion in a first direction is greater than or equal to a greater one of the first skin depth and the second skin depth.

13. The electronic device according to claim 12 , further comprising:
a third insulating pattern disposed on the second metal pattern; and
a third metal pattern disposed on the third insulating pattern.

14. The electronic device according to claim 13 , wherein the third metal pattern has a third thickness greater than or equal to a third skin depth of the third metal pattern.

15. The electronic device according to claim 12 , further comprising a first insulating pattern, wherein in the cross-sectional view, the first pattern is disposed between the first metal pattern and the second metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

16. The electronic device according to claim 12 , wherein an edge of the second metal pattern is recessed from an edge of the first metal pattern in the cross-sectional view.

17. The electronic device according to claim 12 , wherein an edge of the second metal pattern is aligned with an edge of the first metal pattern in the cross-sectional view.

18. The electronic device according to claim 12 , wherein an edge of the second metal pattern exceeds an edge of the first metal pattern in the cross-sectional view.

19. The electronic device according to claim 12 , wherein the first metal pattern has a first thickness greater than or equal to the first skin depth, and the second metal pattern has a second thickness greater than or equal to the second skin depth in the cross-sectional view.

Assignees

• Innolux Corp

Inventors

• Cheng Chung-Chun
• Ho Chia-Chi
• Tseng Chia-Ping
• Wu Yan-Zheng
• Hsu Yao-Wen

Classifications

• H01P5/028

  between strip lines · CPC title

• H01P3/088

  Stacked transmission lines · CPC title

• H01P3/18

  built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title