Waveguide components of waveguides formed with additive manufacturing

Patent metadata

Field	Value
Publication number	US-12512574-B2
Application number	US-202218072516-A
Country	US
Kind code	B2
Filing date	Nov 30, 2022
Priority date	Dec 30, 2021
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

First claim

What is claimed is:

1 . A method, for forming a radio frequency (“RF”) waveguide device by additive manufacturing, the method comprising:
fabricating a RF channel comprising at least one wall; and
fabricating a RF component comprising an unsupported span extending from the at least one wall of the RF channel, wherein the unsupported span is formed at least in part by building up a first unsupported surface to extend from one of the at least one wall at a first oblique angle relative to the angle and a second unsupported surface to extend from one of the at least one wall at a second oblique angle, wherein the first and second unsupported surfaces join together at an apex between the first and second unsupported surfaces,
wherein the unsupported span is fabricated without the use of an underlying supporting structure, wherein the unsupported span is completed using additive manufacturing without post processing machining,
wherein the RF component comprises a waveguide splitter disposed within a horn section of the RF channel, and wherein the first and second unsupported surfaces join together to form a chevron profile on the waveguide splitter.

2 . The method of claim 1 , wherein the unsupported surface is fabricated with a surface finish with a Ra of less than 250 micro inches.

3 . The method of claim 1 , wherein the first oblique angle and the second oblique angle are is between 25 degrees and 65 degrees relative to the the at least one wall.

4 . The method of claim 1 , wherein the first oblique angle is equal to the second oblique angle.

5 . The method of claim 1 , wherein the at least one wall includes a first wall and a second wall, wherein the first unsupported surface extends from the first wall and the second unsupported surface extends from the second wall and are joined together at the apex between the first and second walls.

6 . A method, for forming a radio frequency (“RF”) waveguide device by additive manufacturing, the method comprising:
fabricating a RF channel comprising at least one wall; and
fabricating a RF component comprising an unsupported span extending from the at least one wall of the RF channel, wherein the unsupported span is formed at least in part by building up at least one unsupported surface to extend from the at least one wall at an oblique angle relative to the wall,
wherein the unsupported span is fabricated without the use of an underlying supporting structure, wherein the unsupported span is completed using additive manufacturing without post processing machining,
wherein the at least one unsupported surface is fabricated in an arced profile on the unsupported span.

7 . The method of claim 6 , wherein the at least one wall includes a first wall and a second wall, wherein the unsupported span is formed at least in part by building up a first unsupported surface to extend from the first wall and building up a second unsupported surface to extend from the second wall that join together at an apex between the first and second unsupported surfaces, wherein the first and second unsupported surfaces form the arced profile on the unsupported span.

Assignees

• Raytheon Co

Inventors

• Benedict James
• Binek Lawrence A
• Klek Erika

Classifications

• H01P11/001

  Manufacturing waveguides or transmission lines of the waveguide type · CPC title

• H01P5/20

  Magic-T junctions · CPC title

• H01P3/20

  Quasi-optical arrangements for guiding a wave, e.g. focusing by dielectric lenses · CPC title

• H01P5/12

  Coupling devices having more than two ports (H01P5/04 takes precedence) · CPC title

• H01P3/18 Primary

  built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers · CPC title