Waveguide structure

Patent metadata

Field	Value
Publication number	US-11764451-B2
Application number	US-202117152800-A
Country	US
Kind code	B2
Filing date	Jan 20, 2021
Priority date	Jun 4, 2020
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

A waveguide structure includes a dielectric layer, a plurality of circuit layers, a plurality of insulation layers, and a conductor connection layer. The dielectric layer has an opening. The circuit layers are disposed on the dielectric layer. The insulation layers and the circuit layers are alternately stacked. The conductor connection layer covers an outer wall of the opening in a direction perpendicular to the circuit layers and connects at least two circuit layers on two opposite sides of the opening. At least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening.

First claim

What is claimed is:

1. A waveguide structure, comprising:
a dielectric layer comprising an opening;
a plurality of circuit layers disposed on the dielectric layer;
a plurality of insulation layers alternately stacked with the circuit layers; and
a conductor connection layer covering an outer wall of the opening in a direction perpendicular to the circuit layers and connecting at least two of the circuit layers located on two opposite sides of the dielectric layer, wherein at least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening,
wherein the dielectric layer comprises a first surface and a second surface opposite to each other, the circuit layers comprise a first inner circuit layer, a second inner circuit layer, a first build-up circuit layer, and a second build-up circuit layer, the insulation layers comprise a first insulation layer and a second insulation layer, and the conductor connection layer connects the first inner circuit layer and the second inner circuit layer,
wherein the first inner circuit layer is disposed on the first surface of the dielectric layer, the first insulation layer is located between the first build-up circuit layer and the first inner circuit layer, the first insulation layer comprises a first opening in communication with the opening, the second inner circuit layer is disposed on the second surface of the dielectric layer, the second insulation layer is located between the second build-up circuit layer and the second inner circuit layer, the second insulation layer comprises a second opening in communication with the opening, an inner wall of the first opening and an inner wall of the second opening are flush with the conductor connection layer, the first build-up circuit layer extends to cover the first opening, the second build-up circuit layer extends to cover the second opening, and a part of the first build-up circuit layer, the inner wall of the first opening, the conductor connection layer, the inner wall of the second opening, and a part of the second build-up circuit layer defines the air cavity.

2. The waveguide structure according to claim 1 , further comprising:
a plurality of conductive vias disposed on two opposite sides of the air cavity and penetrating through the first build-up circuit layer, the first insulation layer, the first inner circuit layer, the dielectric layer, the second inner circuit layer, the second insulation layer, and the second build-up circuit layer, wherein the conductive vias electrically connect the first build-up circuit layer, the first inner circuit layer, the second inner circuit layer, and the second build-up circuit layer.

3. A waveguide structure, comprising:
a dielectric layer comprising an opening;
a plurality of circuit layers disposed on the dielectric layer;
a plurality of insulation layers alternately stacked with the circuit layers; and
a conductor connection layer covering an outer wall of the opening in a direction perpendicular to the circuit layers and connecting at least two of the circuit layers located on two opposite sides of the dielectric layer, wherein at least the conductor connection layer and a part of the circuit layers define an air cavity for transmitting signals at a position corresponding to the opening,
wherein the dielectric layer comprises a first surface and a second surface opposite to each other, the circuit layers comprise a first inner circuit layer, a second inner circuit layer, a first build-up circuit layer, and a second build-up circuit layer, the insulation layers comprise a first insulation layer and a second insulation layer, and the conductor connection layer connects the first inner circuit layer and the second inner circuit layer,
wherein the first insulation layer and the second insulation layer are located on the first surface and the second surface of the dielectric layer, respectively, the first build-up circuit layer and the second build-up circuit layer cover the first insulation layer and the second insulation layer, respectively, the first insulation layer extends to cover a first part of the opening located between the first inner circuit layer and the first build-up circuit layer, the second insulation layer extends to cover a second part of the opening located between the second inner circuit layer and the second build-up circuit layer, and a part of the first build-up circuit layer, a part of the second build-up circuit layer, and the conductor connection layer define the air cavity.

4. The waveguide structure according to claim 1 , wherein the first insulation layer is located between the first build-up circuit layer and the first inner circuit layer, the second insulation layer is located between the second build-up circuit layer and the second inner circuit layer, the second build-up circuit layer covers the second surface of the dielectric layer and comprises a coupling opening in communication with the opening, and the conductor connection layer connects the first inner circuit layer, the first build-up circuit layer, and the second build-up circuit layer.

5. The waveguide structure according to claim 4 , wherein the circuit layers further comprise a third build-up circuit layer, and the insulation layers further comprise a third insulation layer, the third insulation layer covers the second build-up circuit layer, the third build-up circuit layer covers a part of the third insulation layer, and the second build-up circuit layer, the third insulation layer, and the third build-up circuit layer define a microstrip line portion.

6. The waveguide structure according to claim 5 , further comprising:
a plurality of conductive vias disposed around the air cavity and penetrating through the first build-up circuit layer, the first insulation layer, the first inner circuit layer, the second inner circuit layer, and the second insulation layer, wherein the conductive vias electrically connect the first build-up circuit layer, the first inner circuit layer, the second inner circuit layer, and the second build-up circuit layer.

7. The waveguide structure according to claim 5 , further comprising:
a feed portion penetrating through the third insulation layer and passing through the coupling opening to electrically connect the first inner circuit layer and the third build-up circuit layer; and
a protective layer covering a surrounding surface of the feed portion, wherein the feed portion is electrically insulated from the second build-up circuit layer through the protective layer.

8. The waveguide structure according to claim 4 , further comprising:
an antenna assembly comprising at least one antenna element, wherein the insulation layers further comprise a third insulation layer, the third insulation layer covers the second build-up circuit layer and comprises an insulation opening in communication with the opening and the coupling opening, the antenna assembly covers the third insulation layer, the antenna element is disposed corresponding to the insulation opening, and the conductor connection layer connects the first inner circuit layer, the first build-up circuit layer, the second inner circuit layer, and the second build-up circuit layer.

Assignees

• Subtron Technology Co Ltd

Inventors

• Tarng Jenn-Hwan
• Liu nai-chen
• Lin Yin-Kai
• Lee Tsung-Han
• Chang Chao-Wei

Classifications

• H01P3/12 Primary

  Hollow waveguides (H01P3/20 takes precedence) · CPC title

• H01P3/121 Primary

  integrated in a substrate · CPC title

• H01P1/207 Primary

  Hollow waveguide filters (H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence) · CPC title

• H01P3/18

  built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers · CPC title

• H01P5/028

  between strip lines · CPC title