Surface mountable microstrip line coupler having a coupling factor that is greater than −30dB at 28 GHz

Patent metadata

Field	Value
Publication number	US-11652265-B2
Application number	US-202117190776-A
Country	US
Kind code	B2
Filing date	Mar 3, 2021
Priority date	Mar 6, 2018
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

First claim

What is claimed is:

1. A high frequency, surface mountable coupler comprising:
a monolithic base substrate having a top surface, a bottom surface, a length in a longitudinal direction, and a width in a lateral direction that is perpendicular to the longitudinal direction;
a first thin film microstrip disposed on the top surface of the monolithic base substrate, the first microstrip having an input end and an output end;
a second thin film microstrip disposed on the top surface of the monolithic base substrate, the second microstrip having an input end and an output end; and
at least one via extending through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate, the at least one via electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip;
wherein the coupler is configured for grid array type mounting, and
wherein the coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

2. The coupler of claim 1 , wherein the coupler has a coupling factor that is greater than about −30 dB from about 10 GHz to about 70 GHz.

3. The coupler of claim 1 , further comprising at least one contact pad disposed on the bottom surface of the base substrate, the at least one contact pad electrically connected with the at least one via.

4. The coupler of claim 1 , further comprising a base ground plane disposed on the bottom surface of the monolithic base substrate.

5. The coupler of claim 4 , wherein the at least one via comprises a pair of vias, and wherein the base ground plane extends between the pair of vias in one of the longitudinal or lateral directions.

6. The coupler of claim 5 , further comprising a pair of contact pads disposed on the bottom surface of the base substrate, each contact pad of the pair of contact pads electrically connected with a respective one via of the pair of vias, wherein the base ground plane extends between the pair of vias in one of the longitudinal or lateral directions without directly contacting either contact pad of the pair of contact pads.

7. The coupler of claim 1 , wherein each of the length and the width of the base substrate is less than about 7 mm.

8. The coupler of claim 1 , wherein the base substrate comprises a ceramic material.

9. The coupler of claim 1 , wherein the base substrate comprises sapphire.

10. The coupler of claim 1 , further comprising a cover substrate arranged on the top surface of the base substrate.

11. The coupler of claim 10 , further comprising a cover ground plane disposed on a top surface of the cover substrate.

12. The coupler of claim 11 , wherein the cover ground plane is electrically connected with a base ground plane disposed on the bottom surface of the monolithic base substrate.

13. The coupler of claim 12 , wherein the at least one via comprises a ground via extending through each of the base substrate and the cover substrate, the ground via electrically connecting the cover ground plane with the base ground plane.

14. The coupler of claim 1 , wherein coupler further comprises four contact pads disposed on the bottom surface of the base substrate, and wherein the at least one via comprises:
a first via electrically connecting the input end of the first thin film microstrip to a first of the four contact pads;
a second via electrically connecting the output end of the first thin film microstrip to a second of the four contact pads;
a third via electrically connecting the input end of the second thin film microstrip to a third of the four contact pads; and
a fourth via electrically connecting the output end of the second thin film microstrip to a fourth of the four contact pads.

15. The coupler of claim 1 , further comprising a polymeric protective layer exposed along an exterior of the coupler.

16. The coupler of claim 1 , wherein at least a portion of the first thin film microstrip and at least a portion of the second thin film microstrip extend parallel to each other in a first direction along a coupling length, the coupling length ranging from about 0.1 mm to about 3.8 mm.

17. The coupler of claim 16 , wherein the parallel portions of the first thin film microstrip and the second thin film microstrip are spaced apart by a gap distance, the gap distance ranging from about 50 micrometers to about 750 micrometers.

18. A method for forming a high frequency, surface mountable coupler, the method comprising:
forming at least one via through hole that extends from a top surface of a monolithic base substrate to a bottom surface of the monolithic base substrate;
depositing a first thin film microstrip and a second thin film microstrip on the top surface of the monolithic base substrate, each of the first and second thin film microstrips being sized and spaced apart such that the coupler has a coupling factor that is greater than about −30 dB at about 28 GHz; and
depositing a conductive via material inside the at least one via through hole to form at least one via electrically connecting at least one of the first thin film microstrip or the second thin film microstrip with a contact pad on the bottom surface of the monolithic base substrate,
wherein at least a portion of the first thin film microstrip and at least a portion of the second thin film microstrip extend parallel to each other in a first direction along a coupling length, the coupling length ranging from about 0.1 mm to about 3.8 mm.

19. The method of claim 18 , wherein forming the at least one via through hole comprises laser drilling the at least one via through hole.

20. A high frequency, surface mountable coupler comprising:
a monolithic base substrate having a top surface, a bottom surface, a length in a longitudinal direction, and a width in a lateral direction that is perpendicular to the longitudinal direction;
a first thin film microstrip disposed on the top surface of the monolithic base substrate, the first microstrip having an input end and an output end;
a second thin film microstrip disposed on the top surface of the monolithic base substrate, the second microstrip having an input end and an output end; and
at least one via extending through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate, the at least one via electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip;
wherein at least a portion of the first thin film microstrip and at least a portion of the second thin film microstrip extend parallel to each other in a first direction,
wherein the parallel portions of the first thin film microstrip and the second thin film microstrip are spaced apart by a gap distance, the gap distance ranging from about 50 micrometers to about 750 micrometers, and
wherein the coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.

Assignees

• Avx Corp
• Kyocera Avx Components Corp

Inventors

• Talalaevsky Arie Leonid
• Marek Michael
• O'Neill Elinor

Classifications

• H04W88/08

  Access point devices · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H01P5/12 Primary

  Coupling devices having more than two ports (H01P5/04 takes precedence) · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title