Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process
US-2021234525-A1 · Jul 29, 2021 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L41/337 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 91 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 5 |
| 2017 | 6 |
| 2018 | 8 |
| 2019 | 9 |
| 2020 | 24 |
| 2021 | 15 |
| 2022 | 10 |
| 2023 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic devices formed in a cavity between substrates
US-11050407-B2 · Jun 29, 2021 · US
Vibration detection element and method for manufacturing the same
US-2021123799-A1 · Apr 29, 2021 · US
Method for manufacturing a substrate for a radiofrequency device
US-2021075389-A1 · Mar 11, 2021 · US
Assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing same
US-2020350485-A1 · Nov 5, 2020 · US
Heterostructure and method of fabrication
US-10826459-B2 · Nov 3, 2020 · US
Method of manufacturing surface acoustic wave device chips
US-10826456-B2 · Nov 3, 2020 · US
Method for healing defects in a layer obtained by implantation then detachment from a substrate
US-2020328342-A1 · Oct 15, 2020 · US
Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly
US-2020313640-A1 · Oct 1, 2020 · US
Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
US-2020313639-A1 · Oct 1, 2020 · US
Joined body of piezoelectric material substrate and support substrate, and acoustic wave element
US-2020313643-A1 · Oct 1, 2020 · US
Piezoelectric acoustic resonator with improved tcf manufactured with piezoelectric thin film transfer process
US-2020304087-A1 · Sep 24, 2020 · US
Method for producing ceramic multi-layer components
US-10784435-B2 · Sep 22, 2020 · US
Method for manufacturing piezoelectric thin-film element
US-10771032-B2 · Sep 8, 2020 · US
Methods of manufacturing electronic devices formed in a cavity and including a via
US-10763820-B2 · Sep 1, 2020 · US
Bonding method
US-10720566-B2 · Jul 21, 2020 · US
Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly
US-2020227623-A1 · Jul 16, 2020 · US
Wireless communication infrastructure system configured with a single crystal piezo resonator and filter structure using thin film transfer process
US-2020220513-A1 · Jul 9, 2020 · US
Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
US-2020220514-A1 · Jul 9, 2020 · US
Piezoelectric device and production method for piezoelectric device
US-10700262-B2 · Jun 30, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L41/337?
- CPC H01L41/337 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L41/337 (Electricity)?
- Our database includes 91 publications tagged with this CPC code.
- Is patent activity under CPC H01L41/337 growing?
- Publication counts under this code: 10 in 2022 vs 10 in 2023 (latest complete years).