Piezoelectric device and production method for piezoelectric device

US10700262B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10700262-B2
Application numberUS-201715600828-A
CountryUS
Kind codeB2
Filing dateMay 22, 2017
Priority dateDec 8, 2014
Publication dateJun 30, 2020
Grant dateJun 30, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A piezoelectric resonator includes a piezoelectric thin film including a functional conductor, a fixing layer provided on a principal surface of the piezoelectric thin film to define a void that overlaps a functional portion region, and a support substrate on a principal surface of the fixing layer. A sacrificial layer is provided on a principal surface of a piezoelectric substrate and the fixing layer is provided on the principal surface of the piezoelectric substrate to cover the sacrificial layer. The support substrate is attached to a surface of the fixing layer and the piezoelectric thin film is peeled from the piezoelectric substrate. The functional conductor is provided on the piezoelectric thin film, a through hole is provided in the piezoelectric thin film to straddle a boundary between the fixing layer and the sacrificial layer, and the sacrificial layer is removed by wet etching using the through hole to form the void.

First claim

Opening claim text (preview).

What is claimed is: 1. A piezoelectric device comprising: a piezoelectric film including a through hole provided in a thickness direction; a functional conductor provided on the piezoelectric film; a fixing layer provided on a principal surface of the piezoelectric film such that a void overlaps a region where the functional conductor is provided in plan view; and a support substrate provided on a first principal surface of the fixing layer, the first principal surface being opposite to a second principal surface of the fixing layer which is a principal surface of the piezoelectric film side; wherein the fixing layer includes a step provided in an inner wall surface of the fixing layer at a position overlapping the through hole in plan view. 2. The piezoelectric device according to claim 1 , wherein the step is provided at a position between the second principal surface and a bottom of the fixing layer, in a direction of a thickness of the fixing layer; and an angle of inclination of the step is different from an angle of inclination of the inner wall surface except for the step, in a cross-sectional view. 3. The piezoelectric device according to claim 1 , wherein the functional conductor includes functional conductors disposed to define an interdigital transducer. 4. The piezoelectric device according to claim 3 , wherein the multiple functional conductors are electrically connected to wiring conductors provided on a front surface of the piezoelectric film. 5. The piezoelectric device according to claim 4 , wherein the wiring conductors are provided on the front surface of the piezoelectric film to not overlap the void. 6. The piezoelectric device according to claim 4 , wherein the multiple functional conductors and the wiring conductors are made of Al, Cu, or Au. 7. The piezoelectric device according to claim 1 , wherein a plurality of the through holes are provided. 8. The piezoelectric device according to claim 7 , wherein the plurality of the through holes are provided at an outermost boundary of a periphery of the void. 9. The piezoelectric device according to claim 1 , wherein the step is located at an off-center position in the through hole.

Assignees

Inventors

Classifications

  • H03H3/02Primary

    for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

  • by polishing or grinding · CPC title

  • H10N30/082Primary

    by etching, e.g. lithography · CPC title

  • using longitudinal or thickness displacement combined with bending, shear or torsion displacement · CPC title

  • Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes · CPC title

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What does patent US10700262B2 cover?
A piezoelectric resonator includes a piezoelectric thin film including a functional conductor, a fixing layer provided on a principal surface of the piezoelectric thin film to define a void that overlaps a functional portion region, and a support substrate on a principal surface of the fixing layer. A sacrificial layer is provided on a principal surface of a piezoelectric substrate and the fixi…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H03H3/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 30 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).