Electronic devices formed in a cavity between substrates

Patent metadata

Field	Value
Publication number	US-11050407-B2
Application number	US-201916582010-A
Country	US
Kind code	B2
Filing date	Sep 25, 2019
Priority date	Dec 2, 2016
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

An electronic device includes a first substrate and a second substrate. A side wall joins the first substrate to the second substrate. The side wall includes a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal. An electronic circuit is disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.

First claim

What is claimed is:

1. An electronic device comprising:
a first substrate and a second substrate;
a side wall joining the first substrate to the second substrate, the side wall including a first alloy layer of a first metal and a second metal bonded directly to an upper surface of the first substrate and a second alloy layer of the first metal and a third metal disposed on top of the first alloy layer and bonded directly to a lower surface of the second substrate, the second metal and the third metal being different from each other and from the first metal; and
an electronic circuit disposed on the lower surface of the second substrate within a cavity defined by the lower surface of the first substrate, the upper surface of the second substrate, and the side wall.

2. The electronic device of claim 1 wherein the side wall is disposed about peripheries of the first and second substrates.

3. The electronic device of claim 1 wherein the second substrate includes a piezoelectric body.

4. The electronic device of claim 3 wherein the electronic circuit includes at least one of a film bulk acoustic resonator, a bulk acoustic wave element, a solidly mounted resonator, and a surface acoustic wave element.

5. The electronic device of claim 1 wherein the first metal has a melting point lower than that of the second metal.

6. The electronic device of claim 1 wherein the first alloy layer has a height greater than a height of the second alloy layer.

7. The electronic device of claim 1 wherein the first metal includes at least one of tin and indium.

8. The electronic device of claim 7 wherein the second metal includes copper.

9. The electronic device of claim 7 wherein the third metal includes gold.

10. The electronic device of claim 1 wherein the first substrate has a thickness different from that of the second substrate.

11. The electronic device of claim 1 further comprising a column disposed between the upper surface of the first substrate and the lower surface of the second substrate within the cavity.

12. The electronic device of claim 11 wherein the second alloy layer is tapered.

13. The electronic device of claim 11 wherein the column comprises a layer of the first alloy stacked on a layer of the second alloy.

14. The electronic device of claim 13 wherein the layer of the second alloy of the column is tapered.

15. The electronic device of claim 1 further comprising a via extending through the second substrate, side surfaces of the via having a surface roughness greater than a surface roughness of the lower surface of the second substrate.

16. The electronic device of claim 15 further comprising a first stop layer including a first metal on the lower surface of the second substrate and a second stop layer including a second metal on a lower surface of the first stop layer, the via terminating on one of the first stop layer and the second stop layer.

17. The electronic device of claim 15 further comprising an external electrode including a first material layer having a portion passing through the via and an upwardly extending portion extending above an upper surface of the second substrate.

18. The electronic device of claim 15 further comprising an electrical connection between the via and the electronic circuit.

19. The electronic device of claim 15 further comprising a column coupled to the via and to the upper surface of the first substrate.

20. The electronic device of claim 1 wherein the second substrate includes an upper surface having a surface roughness greater than a surface roughness of the lower surface of the second substrate.

21. The electronic device of claim 1 further comprising a printed circuit board having a top surface bonded to the first and second substrates and resin including a filler having particles with an average diameter covering the top surface of the printed circuit board, the side wall being internally withdrawn from respective peripheries of the first substrate and the second substrate by a distance that is half or less of the average diameter of the particles of the filler.

Assignees

• Skyworks Solutions Inc

Inventors

• Takano Atsushi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/072

  of bump connectors · CPC title