Vibration detection element and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2021123799-A1
Application number	US-201816635753-A
Country	US
Kind code	A1
Filing date	Jun 21, 2018
Priority date	Aug 1, 2017
Publication date	Apr 29, 2021
Grant date	—

Abstract

A vibration detection element (10) includes substrates (1 to 3), a support member (22), a support member (32), and an oscillator (4). The substrates (1 to 3) have a space portion (SP) having a bottom surface (21A) and a bottom surface (31A) opposed to the bottom surface (21A). The support member (22) protrudes from the bottom surface (21A) toward the bottom surface (31A) of the space portion (SP). The support member (32) protrudes from the bottom surface (31A) toward the bottom surface (21A) of the space portion. The oscillator (4) is disposed in contact with the support member (22) or the support member (32) and capable of vibrating in the space portion (SP) and has a thickness less than 10 μm. The support members (22, 32) each include multiple supports which prevent the oscillator (4) from contacting the bottom surface (21A) or the bottom surface (31A).

First claim

1 . A method for manufacturing a vibration detection element, comprising:
a first step including joining a first substrate having an oscillator adhered with a heat-resistant adhesive to a first support member protruding from a bottom surface of a first recess of the first substrate and a second substrate having a second support member protruding from a bottom surface of a second recess of the second substrate so that the oscillator is opposed to the second support member; and a second step removing the heat-resistant adhesive after the first step.

2 . The method for manufacturing a vibration detection element according to claim 1 , wherein the first step comprises:
a first sub step producing the first substrate having the oscillator adhered to the first support member with the heat-resistant adhesive using a third substrate to which the oscillator is adhered; and a second sub step joining the first substrate and the second substrate after the first sub step so that the oscillator is opposed to the second support member.

3 . The method for manufacturing a vibration detection element according to claim 2 , wherein the first sub step comprises:
a sub step A forming the first recess and the first support member at the first substrate; and a sub step B including adhering the oscillator to the third substrate, applying the heat-resistant adhesive on an exposed surface of the oscillator, and adhering the oscillator to the first support member with the applied heat-resistant adhesive, and the second sub step comprises: a sub step C forming the second recess and the second support member at the second substrate; and a sub step D joining the first substrate and the second substrate after the sub step B so that the exposed surface of the oscillator is opposed to the second support member.

4 . The method for manufacturing a vibration detection element according to claim 3 , wherein in the sub step D, the first substrate and the second substrate are joined so that the exposed surface of the oscillator is opposed to the second support member in a space formed by the first and second recesses.

5 . The method for manufacturing a vibration detection element according to claim 3 , wherein the sub step B comprises:
a sub step B- 1 adhering a piezoelectric plate to the third substrate by an adhesive layer; a sub step B- 2 polishing the piezoelectric plate into a desired thickness; a sub step B- 3 including applying the heat-resistant adhesive on a surface of the polished piezoelectric plate after the sub step B- 2 and curing the applied heat-resistant adhesive; a sub step B- 4 joining the first substrate and the second substrate by hot pressing after the sub step B- 3 so that the heat-resistant adhesive is in contact with a surface of the first substrate and a surface of the first support member; a sub step B- 5 removing the third substrate and the adhesive layer after the sub step B- 4 ; and a sub step B- 6 including patterning the polished piezoelectric plate into a desired shape and producing the oscillator adhered to the first support member with the heat-resistant adhesive after the sub step B- 5 .

6 . The method for manufacturing a vibration detection element according to claim 3 , wherein the sub step B comprises:
a sub step B- 1 including adhering the piezoelectric plate on a surface of the third substrate by an adhesive layer, polishing the adhered piezoelectric plate into a desired thickness, and patterning the piezoelectric plate into a desired shape; a sub step B- 2 including applying a heat-resistant adhesive on a surface of the oscillator and curing the applied heat-resistant adhesive; a sub step B- 3 joining the first substrate and the third substrate by hot pressing after the sub step B- 2 so that the oscillator is positioned on the first support member; and a sub step B- 4 removing the third substrate and the adhesive layer after the sub step B- 3 .

7 . The method for manufacturing a vibration detection element according to claim 6 , wherein the sub step B further comprises a sub step B- 5 patterning the heat-resistant adhesive after the sub step B- 2 so that only the part of the heat-resistant adhesive opposed to the first support member remains, and
the sub step B- 3 is performed after the sub step B- 5 .

8 . The method for manufacturing a vibration detection element according to claim 7 , wherein the adhesive layer includes an organic material or an inorganic material.

9 . The method for manufacturing a vibration detection element according to claim 8 , wherein the hot pressing is performed in a nitrogen atmosphere or in a vacuum.

10 . The method for manufacturing a vibration detection element according to claim 1 , wherein the heat-resistant adhesive includes a single organic material or an organic material containing particles having a particle size from tens of nm to hundreds of nm.

11 . The method for manufacturing a vibration detection element according to claim 1 , wherein in the second step, the heat-resistant adhesive is removed by one of a basic solution, an acidic solution, and an organic solution.

12 . A vibration detection element, comprising:
a substrate including a space portion having a first surface and a second surface opposed to the first surface; a first support member protruding from the first surface toward the second surface of the space portion; a second support member protruding from the second surface toward the first surface of the space portion; and an oscillator provided in contact with the first support member or the second support member to be capable of vibrating in the space portion and having a thickness less than 10 μm the first and second support members each including multiple supports which prevent the oscillator from contacting the first surface or the second surface.

13 . The method for manufacturing a vibration detection element according to claim 4 , wherein the sub step B comprises:
a sub step B- 1 adhering a piezoelectric plate to the third substrate by an adhesive layer; a sub step B- 2 polishing the piezoelectric plate into a desired thickness; a sub step B- 3 including applying the heat-resistant adhesive on a surface of the polished piezoelectric plate after the sub step B- 2 and curing the applied heat-resistant adhesive; a sub step B- 4 joining the first substrate and the second substrate by hot pressing after the sub step B- 3 so that the heat-resistant adhesive is in contact with a surface of the first substrate and a surface of the first support member; a sub step B- 5 removing the third substrate and the adhesive layer after the sub step B- 4 ; and a sub step B- 6 including patterning the polished piezoelectric plate into a desired shape and producing the oscillator adhered to the first support member with the heat-resistant adhesive after the sub step B- 5 .

14 . The method for manufacturing a vibration detection element according to claim 4 , wherein the sub step B comprises:
a sub step B- 1 including adhering the piezoelectric plate on a surface of the third substrate by an adhesive layer, polishing the adhered piezoelectric plate into a desired thickness, and patterning the piezoelectric plate into a desired shape; a sub step B- 2 including applying a heat-resistant adhesive on a surface of the oscillator and curing the applied heat-resistant adhesive; a sub step B- 3 joining the first substrate and the third substrate by hot pressing after the sub step B- 2 so that the oscillator is positioned on the first support member; and a sub step B- 4 removing the third substrate and the adhesive layer af

Assignees

• Univ Osaka

Inventors

• Ogi Hirotsugu
• Nonaka Tomoyuki
• Kato Fumihito

Classifications

• G01N2291/0255

  (Bio)chemical reactions, e.g. on biosensors · CPC title

• G01N29/022

  Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices (microdevices per se B81B) · CPC title

• G01N5/02

  by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content {(absorption bulbs B01D53/00)} · CPC title

• B81B3/00

  Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B5/00 takes precedence) · CPC title

• G01N2291/014

  Resonance or resonant frequency · CPC title