Superconducting bump bonds
US-10497853-B2 · Dec 3, 2019 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L39/045 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 159 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 5 |
| 2017 | 6 |
| 2018 | 18 |
| 2019 | 40 |
| 2020 | 38 |
| 2021 | 24 |
| 2022 | 17 |
| 2023 | 8 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrating josephson amplifiers or josephson mixers into printed circuit boards
US-2019343003-A1 · Nov 7, 2019 · US
Package substrates with top superconductor layers for qubit devices
US-10468578-B2 · Nov 5, 2019 · US
Methods for making a superconducting device with at least one enclosure
US-10424712-B2 · Sep 24, 2019 · US
Superconducting device with at least one enclosure
US-10424711-B2 · Sep 24, 2019 · US
Superconducting qubit device packages
US-2019273197-A1 · Sep 5, 2019 · US
Qubit network non-volatile identification
US-10396268-B2 · Aug 27, 2019 · US
Donor- or acceptor-based spin qubits with isotopically purified materials
US-10388848-B2 · Aug 20, 2019 · US
Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
US-10381541-B2 · Aug 13, 2019 · US
Method for electrically interconnecting at least two substrates and multichip module
US-10373928-B1 · Aug 6, 2019 · US
Controlling a state of a qubit assembly via tunable coupling
US-2019237648-A1 · Aug 1, 2019 · US
Josephson junctions for improved qubits
US-2019228332-A1 · Jul 25, 2019 · US
Flip chip integration on qubit chips
US-10355193-B2 · Jul 16, 2019 · US
Shielded interconnects
US-10319896-B2 · Jun 11, 2019 · US
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
US-10304004-B2 · May 28, 2019 · US
Superconducting device with thermally conductive heat sink
US-10290676-B2 · May 14, 2019 · US
Incorporating arrays of josephson junctions in a josephson junction ring modulator in a josephson parametric converter
US-10276771-B2 · Apr 30, 2019 · US
Josephson junctions for improved qubits
US-10268968-B2 · Apr 23, 2019 · US
Two-component bump metallization
US-2019103542-A1 · Apr 4, 2019 · US
Thermal impedance amplifier
US-10236433-B1 · Mar 19, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L39/045?
- CPC H01L39/045 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L39/045 (Electricity)?
- Our database includes 159 publications tagged with this CPC code.
- Is patent activity under CPC H01L39/045 growing?
- Publication counts under this code: 8 in 2023 vs 1 in 2024 (latest complete years).