Superconducting device with thermally conductive heat sink

Patent metadata

Field	Value
Publication number	US-10290676-B2
Application number	US-201715677756-A
Country	US
Kind code	B2
Filing date	Aug 15, 2017
Priority date	Aug 15, 2017
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

An integrated circuit is provided that comprises a resistor, a first superconducting structure coupled to a first end of the resistor, and a second superconducting structure coupled to a second end of the resistor. A thermally conductive heat sink structure is coupled to the second end of the resistor for moving hot electrons from the resistor prior to the electrons generating phonons.

First claim

What is claimed is:

1. An integrated circuit comprising:
a resistor;
a first superconducting structure coupled to a first end of the resistor;
a second superconducting structure coupled to a second end of the resistor; and
a thermally conductive heat sink structure coupled to the second end of the resistor for removing heat from electrons of the resistor prior to the electrons creating phonons;
wherein the thermally conductive heat sink structure is formed of a normal metal that is not superconducting.

2. The circuit of claim 1 , wherein the thermally conductive heat sink structure is encapsulated in a dielectric structure along with the resistor, and the first and second superconducting structures.

3. The circuit of claim 1 , wherein the thermally conductive heat sink structure is a thermally conductive sink plate coupled to the resistor by a thermally conductive contact that extends through a portion of a dielectric structure that encapsulates the resistor and the first and second superconducting structures, the thermally conductive heat sink plate being disposed on one of above the top surface and below the bottom surface of the dielectric structure.

4. The circuit of claim 3 , wherein the thermally conductive heat sink plate is disposed on the top surface of the dielectric structure, and further comprising a thermally conductive heat spreader disposed below the bottom surface of the dielectric structure, and a thermally conductive through substrate via (TSV) that couples the thermally conductive heat sink plate to the thermally conductive heat spreader, the thermally conductive heat spreader being configured to be disposed adjacent a cryo-cooler.

5. The circuit of claim 1 , wherein the first and second superconducting structures are disposed in a first dielectric layer, the resistor is disposed in a second dielectric layer, and the first and second superconducting structures are coupled to respective ends of the resistor by superconducting contacts that extend through an intermediate dielectric layer residing in between the first dielectric layer and the second dielectric layer, the first dielectric layer, the intermediate layer and the second dielectric layer forming a dielectric structure.

6. The circuit of claim 1 , further comprising a plurality of additional resistors with each resistor being coupled between respective superconducting structures, each of the plurality of resistors and the resistor being coupled on a second end to the thermally conductive heat sink structure which forms a common ground.

7. The circuit of claim 6 , wherein the superconducting structures are disposed in a first dielectric layer, the resistor and the plurality of additional resistors are disposed in a second dielectric layer, and the respective superconducting structures are coupled to respective ends of the resistor to form a plurality of active circuits by superconducting contacts that extend through an intermediate dielectric layer residing in between the first dielectric layer and the second dielectric layer.

8. The circuit of claim 7 , wherein the thermally conductive heat sink structure is a thermally conductive heat sink plate that is coupled to second ends of each of the plurality of additional resistors by thermally conductive contacts that extends through a portion of a dielectric structure, the thermally conductive heat sink plate being disposed on one of the top surface and bottom surface of the dielectric structure.

9. The circuit of claim 8 , wherein the thermally conductive heat sink plate is disposed on the top surface of the dielectric structure, and further comprising a thermally conductive heat spreader disposed on a bottom surface of the dielectric structure, and a thermally conductive through substrate via (TSV) that couples the thermally conductive heat sink plate to the thermally conductive heat spreader, the thermally conductive heat spreader being configured to be disposed adjacent a cryo-cooler.

10. The circuit of claim 9 , further comprising a plurality of additional thermally conductive heat plates disposed on the top surface of the dielectric structure, and each coupled to the thermally conductive heat spreader by respective thermally conductive through substrate vias (TSVs) that couples the respective thermally conductive heat sink plate to the thermally conductive heat spreader.

11. The circuit of claim 1 , wherein the thermally conductive sink structure is formed of copper, gold, silver, tungsten, molybdenum, iridium, and/or rhodium.

12. A monolithic microwave integrated circuit (MMIC) comprising a carrier and the integrated circuit of claim 1 residing on the carrier.

13. A monolithic microwave integrated circuit (MMIC) comprising:
a dielectric structure overlying a substrate;
a plurality of superconducting structures residing in a first dielectric layer of the dielectric structure;
a plurality of resistors residing in a second dielectric layer of the dielectric structure;
a plurality of superconducting contacts residing in an intermediate layer of the dielectric structure, the intermediate layer residing between the first dielectric layer and the second dielectric layer, a first superconducting contact of the plurality of superconducting contacts coupling a first end of a given resistor to a first superconducting structure, and a second superconducting contact of the plurality of superconducting contacts coupling a second end of the given resistor to a second superconducting structure for each of the plurality of resistors; and
a thermally conductive heat sink structure coupled to second ends of each of the plurality of resistors to form a common ground and to move electrons from the plurality of resistors prior to the electrons being converted to phonons;
wherein the thermally conductive heat sink structure is formed of a normal metal that is not superconducting.

14. The MMIC of claim 13 , wherein the thermally conductive heat sink structure is encapsulated in a dielectric structure.

15. The MMIC of claim 13 , wherein the thermally conductive heat sink structure is a thermally conductive heat sink plate that is coupled to second ends of each of the plurality of additional resistors by thermally conductive contacts that extends through a portion of a dielectric structure, the thermally conductive heat sink plate being disposed on one of the top surface and bottom surface of the dielectric structure.

16. The MMIC of claim 15 , wherein the thermally conductive heat sink plate is disposed on the top surface of the dielectric structure, and further comprising a thermally conductive heat spreader disposed on a bottom surface of the dielectric structure, and a thermally conductive through substrate via (TSV) that couples the thermally conductive heat sink plate to the thermally conductive heat spreader, the thermally conductive heat spreader being configured to be disposed adjacent a cryo-cooler.

17. The MMIC of claim 16 , further comprising a plurality of additional thermally conductive heat plates disposed on the top surface of the dielectric structure, and each coupled to the thermally conductive heat spreader by respective thermally conductive through substrate vias (TSVs) that couples the respective thermally conductive heat sink plate to the thermally conductive heat spreader.

18. The MMIC of claim 13 , wherein the thermally conductive sink structure is formed of copper, gold, silver, tungsten, molybdenum, iridium, and/or rhodium.

19. The MMIC of claim 13 , wherein the dielectric structure and the substrate reside in a

Assignees

• Pesetski Aaron A
• Loney Patrick Alan
• Northrop Grumman Systems Corp

Inventors

• Pesetski Aaron A
• Loney Patrick Alan

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W44/206

  Wires · CPC title