Fluidic pick-up head for small semiconductor devices
US-2018351030-A1 · Dec 6, 2018 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L33/00 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 307 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 18 |
| 2017 | 10 |
| 2018 | 45 |
| 2019 | 66 |
| 2020 | 47 |
| 2021 | 34 |
| 2022 | 25 |
| 2023 | 25 |
| 2024 | 24 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Led illuminating device
US-2018340658-A1 · Nov 29, 2018 · US
Array substrates for enhancing gate driver on array (goa) reliability
US-2018336830-A1 · Nov 22, 2018 · US
Array substrate and display panel
US-2018336829-A1 · Nov 22, 2018 · US
Goa driving unit
US-2018336834-A1 · Nov 22, 2018 · US
Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component
US-2018294378-A1 · Oct 11, 2018 · US
LED module and method for fabricating the same
US-10074636-B2 · Sep 11, 2018 · US
Color stable red-emitting phosphors
US-10047286-B2 · Aug 14, 2018 · US
Micro device transfer system with pivot mount
US-10043776-B2 · Aug 7, 2018 · US
LED drive circuit including a plurality of LEDs connected in series
US-10044289-B2 · Aug 7, 2018 · US
Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component
US-10026868-B2 · Jul 17, 2018 · US
Adhesive composition, in particular for encapsulating an electronic arrangement
US-2018194978-A1 · Jul 12, 2018 · US
Lift off process for chip scale package solid state devices on engineered substrate
US-9997391-B2 · Jun 12, 2018 · US
Nanoshell, method of fabricating same and uses thereof
US-9991458-B2 · Jun 5, 2018 · US
Method and apparatus for embedding semiconductor devices
US-2018144958-A1 · May 24, 2018 · US
Method of transferring micro devices and micro device transfer apparatus
US-9978629-B1 · May 22, 2018 · US
Transfer Head for Transferring Micro Element and Transferring Method of Micro Element
US-2018122683-A1 · May 3, 2018 · US
Printed circuit board and light-emitting device including same
US-9923123-B2 · Mar 20, 2018 · US
Light emitting element
US-9893237-B2 · Feb 13, 2018 · US
Semiconductor device and method for manufacturing the same
US-2018026140-A1 · Jan 25, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L33/00?
- CPC H01L33/00 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L33/00 (Electricity)?
- Our database includes 307 publications tagged with this CPC code.
- Is patent activity under CPC H01L33/00 growing?
- Publication counts under this code: 24 in 2024 vs 3 in 2025 (latest complete years).