Method of transferring micro devices and micro device transfer apparatus

Patent metadata

Field	Value
Publication number	US-9978629-B1
Application number	US-201715649623-A
Country	US
Kind code	B1
Filing date	Jul 13, 2017
Priority date	Apr 12, 2017
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A method of transferring micro devices is provided. A carrier substrate including a plurality of first electrodes and a plurality of micro devices is provided. The micro devices are separated from each other and respectively electrically connected to the first electrodes. A receiving substrate is made to relatively close to the carrier substrate. The receiving substrate includes a plurality of second electrodes, and the second electrodes and the first electrodes are opposite in electrical property. A first voltage and a second voltage are applied to a portion of the adjacent two first electrodes, so that the micro devices are released from the carrier substrate to the receiving substrate and bonded to the receiving substrate. The first voltage is different from the second voltage. In addition, a micro devices transfer apparatus is also provided.

First claim

What is claimed is:

1. A method of transferring micro devices, comprising:
providing a carrier substrate, the carrier substrate being configured with a plurality of first electrodes and a plurality of micro devices, wherein the micro devices are separated from each other and respectively electrically connected to the first electrodes;
making a receiving substrate to relatively close to the carrier substrate, wherein the receiving substrate is configured with a plurality of second electrodes, and the second electrodes and the first electrodes are opposite in electrical property; and
applying a first voltage and a second voltage to a portion of the adjacent two first electrodes, so that the micro devices are released from the carrier substrate to the receiving substrate and bonded to the receiving substrate, wherein the first voltage is different from the second voltage.

2. The method of transferring micro devices as claimed in claim 1 , wherein each of the micro devices is a light emitting diode.

3. The method of transferring micro devices as claimed in claim 1 , wherein the first voltage and the second voltage are the same or opposite in electrical property.

4. The method of transferring micro devices as claimed in claim 1 , wherein the carrier substrate has a first surface and a second surface opposite to each other, the second surface is located adjacent to the receiving substrate, the micro devices are disposed on the second surface, and the first electrodes are disposed on the first surface or the second surface, or a part of the first electrodes is disposed on the first surface, and another part of the first electrodes is disposed on the second surface.

5. The method of transferring micro devices as claimed in claim 1 , wherein the receiving substrate has a third surface and a fourth surface opposite to each other, the fourth surface is located adjacent to the carrier substrate, and the second electrodes are disposed on the third surface or the fourth surface, or a part of the second electrodes is disposed on the third surface, and another part of the second electrodes is disposed on the fourth surface.

6. The method of transferring micro devices as claimed in claim 1 , wherein the receiving substrate is further configured with a plurality of transfer heads, and the transfer heads respectively and directly contact the micro devices.

7. The method of transferring micro devices as claimed in claim 1 , further comprising:
applying a third voltage and a fourth voltage to a portion of adjacent two second electrodes while applying the first voltage and the second voltage to the portion of the adjacent two first electrodes.

8. A micro device transfer apparatus, comprising:
a carrier substrate, adapted to carry a plurality of micro devices and comprising a plurality of first electrodes, wherein the micro devices are separated from each other and respectively electrically connected to the first electrodes, a portion of the adjacent two first electrodes is adapted to receive a first voltage and a second voltage, and the first voltage is different from the second voltage; and
a receiving substrate, comprising a plurality of second electrodes, wherein the second electrodes and the first electrodes are opposite in electrical property.

9. The micro device transfer apparatus as claimed in claim 8 , wherein each of the micro devices is a light emitting diode.

10. The micro device transfer apparatus as claimed in claim 8 , wherein the first voltage and the second voltage are the same or opposite in electrical property.

11. The micro device transfer apparatus as claimed in claim 8 , wherein the carrier substrate has a first surface and a second surface opposite to each other, the second surface is located adjacent to the receiving substrate, the micro devices are disposed on the second surface, and the first electrodes are disposed on the first surface or the second surface, or a part of the first electrodes is disposed on the first surface, and another part of the first electrodes is disposed on the second surface.

12. The micro device transfer apparatus as claimed in claim 8 , wherein the receiving substrate has a third surface and a fourth surface opposite to each other, the fourth surface is located adjacent to the carrier substrate, and the second electrodes are disposed on the third surface or the fourth surface, or a part of the second electrodes is disposed on the third surface, and another part of the second electrodes is disposed on the fourth surface.

13. The micro device transfer apparatus as claimed in claim 8 , wherein the receiving substrate is further configured with a plurality of transfer heads, and the transfer heads respectively and directly contact the micro devices.

14. The micro device transfer apparatus as claimed in claim 8 , wherein the carrier substrate is a sapphire substrate, and the receiving substrate is a glass substrate.

15. The micro device transfer apparatus as claimed in claim 8 , wherein the carrier substrate is a glass substrate, and the receiving substrate is a driving substrate.

16. The micro device transfer apparatus as claimed in claim 8 , wherein the adjacent two second electrodes are adapted to receive a third voltage and a fourth voltage.

17. The micro device transfer apparatus as claimed in claim 8 , wherein one of the first electrodes receiving the second voltage is surrounded by a plurality of the first electrodes receiving the first voltage.

Assignees

• Acer Inc

Inventors

• Hsiang Jui-Chieh
• Chen Chih-Chiang

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title