Printed circuit board and light-emitting device including same

Patent metadata

Field	Value
Publication number	US-9923123-B2
Application number	US-201515303445-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Apr 10, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.

First claim

The invention claimed is:

1. A printed circuit board, comprising:
a first electrode layer;
a first insulation layer disposed on one surface of the first electrode layer;
a cavity passing through the first insulation layer;
a second electrode layer disposed on the first insulation layer;
a second insulation layer provided on at least a region of the other surface opposite to the one surface of the first electrode layer; and
a first protective layer provided on at least a region of the second insulation layer, wherein at least a portion of the one surface of the first electrode layer is exposed to the outside via the cavity.

2. The printed circuit board of claim 1 , wherein, when a semiconductor element is disposed on the one surface of the first electrode layer exposed via the cavity, the first electrode layer discharges heat generated by the semiconductor element to the outside.

3. The printed circuit board of claim 1 , comprising a second protective layer provided on at least a region of the one surface of the first electrode layer having thereon the first insulation layer and the second electrode layer.

4. The printed circuit board of claim 3 , wherein the second protective layer is provided in a region excluding the cavity.

5. The printed circuit board of claim 3 , wherein the second protective layer is provided to cover at least a portion of a side surface of the first electrode layer.

6. The printed circuit board of claim 1 , wherein the second insulation layer comprises a heat-conductive insulating material.

7. The printed circuit board of claim 1 , wherein the first protective layer comprises aluminum.

8. The printed circuit board of claim 1 , comprising a connector provided at a side of the first electrode layer and formed to expose regions of the first and second electrode layers to the outside.

9. The printed circuit board of claim 8 , wherein, in the connector, the first insulation layer is formed to expose at least a portion of the one surface of the first electrode layer to the outside.

10. A light-emitting device, comprising:
a printed circuit board comprising:
a first electrode layer;
a first insulation layer provided on one surface of the first electrode layer; and
a second electrode layer provided on the first insulation layer;

at least one luminous element provided on the one surface of the first electrode layer;
a conductive adhesive layer interposed between the one surface of the first electrode layer and the at least one luminous element, wherein one surface of the conductive adhesive layer is directly in contact with the one surface of the first electrode layer and the other surface opposite to the one surface of the conductive adhesive layer is directly in contact with the at least one luminous element; and
a connector provided at a side of the printed circuit board and formed to expose regions of the first and second electrode layers to the outside.

11. The light-emitting device of claim 10 , comprising a first protective layer provided on at least a region of the one surface of the first electrode layer having thereon the first insulation layer and the second electrode layer, wherein the first protective layer covers at least a portion of a side surface of the first electrode layer connected to the one surface of the first electrode layer.

12. The light-emitting device of claim 10 , wherein the connector is attachable to and detachable from an external connector including first and second electrode terminals, wherein the first electrode terminal of the external connector is in contact with the exposed region of the first electrode layer, and the second electrode terminal of the external connector is in contact with the exposed region of the second electrode layer.

13. The light-emitting device of claim 10 , wherein one of an anode terminal or a cathode terminal of the luminous element is electrically connected to the first electrode layer, and the other of the anode terminal or the cathode terminal of the luminous element is electrically connected to the second electrode layer.

14. The light-emitting device of claim 10 , wherein the at least one luminous element is provided on the one surface of the first electrode layer via a cavity passing through the first insulation layer.

15. The light-emitting device of claim 10 , wherein a plurality of luminous elements is provided on the one surface of the first electrode layer, wherein the plurality of luminous elements is electrically connected in parallel to the first electrode layer and the second electrode layer.

16. The light-emitting device of claim 10 , wherein a plurality of luminous elements is provided on the one surface of the first electrode layer, wherein one of an anode terminal and a cathode terminal of each of the plurality of luminous elements is electrically connected in parallel to the first electrode layer, and the other of the anode terminal and the cathode terminal of each of the plurality of luminous elements is electrically connected in parallel to the second electrode layer.

17. A light-emitting device, comprising:
a printed circuit board comprising:
a first electrode layer;
a first insulation layer provided on one surface of the first electrode layer;
a cavity passing through the first insulation layer;
a second electrode layer provided on the first insulation layer;
at least one luminous element provided on the one surface of the first electrode layer via the cavity;
a second insulation layer provided on at least a region of the other surface opposite to the one surface of the first electrode layer; and
a protective layer provided on at least a region of the second insulation layer.

18. The printed circuit board of claim 2 , wherein a wire of the semiconductor element is bonded onto the second electrode layer.

19. The printed circuit board of claim 18 , wherein the second electrode layer includes a bonding pad, and wherein the wire of the semiconductor element is bonded onto the bonding pad.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Jeong Han
• Park Jeung Ook
• Yoon Sang In
• Im Hyun Gu

Classifications

• H05K2203/049

  Wire bonding · CPC title

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title