LED module and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10074636-B2
Application number	US-201815883413-A
Country	US
Kind code	B2
Filing date	Jan 30, 2018
Priority date	Aug 11, 2016
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

First claim

What is claimed is:

1. A method for fabricating a display module, comprising:
forming electrode patterns, each of which comprises a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad, in a matrix on a substrate;
loading 1st first bumps, 2nd first bumps, and 3rd first bumps on the first individual electrode pads, the second individual electrode pads, and the third individual electrode pads, respectively, and loading 1st second bumps, 2nd second bumps, and 3rd second bumps on the common electrode pads;
bonding LED chips comprising first LED chips having 1st first electrodes and 1st second electrodes, second LED chips having 2nd first electrodes and 2nd second electrodes, and third LED chips having 3rd first electrodes and 3rd second electrodes in a matrix to a bonding carrier;
moving the bonding carrier such that the 1st first electrodes, the 2nd first electrodes, and the 3rd first electrodes face the 1st first bumps, the 2nd first bumps, and the 3rd first bumps, respectively, and the 1st second electrodes, the 2nd second electrodes, and the 3rd second electrodes face the 1st second bumps, the 2nd second bumps, and the 3rd second bumps, respectively; and
pressurizing the first LED chips, the second LED chips, and the third LED chips to a predetermined pressure such that the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a first height and the 1st second bumps, the 2nd second bumps, and the 3rd second bumps are compressed to a second height (chip placing down),
wherein each of the electrode patterns is formed such that the common electrode pad is aligned to a first end line parallel to the lengthwise direction of the matrix, and the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad are aligned to a second end line parallel to the first end line and are located between the first end line and the second end line; and the chip placing down is carried out such that the first LED chip, the second LED chip, and the third LED chip are arrayed in a line along the lengthwise direction.

2. The method according to claim 1 , wherein the common electrode pad comprises recesses depressed inwardly from the first end line and a first branch, a second branch, and a third branch, whose shapes are defined by the recesses.

3. The method according to claim 1 , wherein the bonding of the LED chips in a matrix to the bonding carrier comprises primarily exposing the bonding carrier to form areas whose adhesive strength is weakened and areas whose adhesive strength remains unweakened on the bonding carrier and pressurizing the areas whose adhesive strength remains unweakened against the LED chips using a rolling pick-up roll to bond the LED chips to the bonding carrier.

4. The method according to claim 3 , wherein the bonding carrier is secondarily exposed to weaken the adhesive strength of the bonding carrier as a whole before the chip placing down, and the chip placing down is carried out such that a chip placing roll pressurizes the LED chips to a predetermined pressure while rolling on the bonding carrier.

Assignees

• Lumens Co Ltd

Inventors

• Yoo Taekyung
• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Her Jimin
• Shin Younghwan
• Han Sol
• Lee Kyujin

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title