Frame member with a porous material between a semiconductor module and heat sink
US-12068217-B2 · Aug 20, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/16 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 853 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 39 |
| 2016 | 34 |
| 2017 | 57 |
| 2018 | 60 |
| 2019 | 86 |
| 2020 | 96 |
| 2021 | 106 |
| 2022 | 99 |
| 2023 | 109 |
| 2024 | 75 |
| 2025 | 75 |
| 2026 | 17 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and related fabrication method
US-2024234370-A1 · Jul 11, 2024 · US
Integrated circuit package and method
US-11935804-B2 · Mar 19, 2024 · US
Heat spreader with flexible tolerance mechanism
US-9496199-B2 · Nov 15, 2016 · US
Hybrid thermal interface material for IC packages with integrated heat spreader
US-9472485-B2 · Oct 18, 2016 · US
Localized strain relief for an integrated circuit
US-9466666-B2 · Oct 11, 2016 · US
Semiconductor device
US-9418910-B2 · Aug 16, 2016 · US
Semiconductor package
US-9397052-B2 · Jul 19, 2016 · US
Semiconductor assembly having a housing
US-9373563-B2 · Jun 21, 2016 · US
Semiconductor device
US-9368463-B2 · Jun 14, 2016 · US
Die-on-interposer assembly with dam structure and method of manufacturing the same
US-9368458-B2 · Jun 14, 2016 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-9362208-B2 · Jun 7, 2016 · US
Substrate warpage control using external frame stiffener
US-9355966-B2 · May 31, 2016 · US
Silicon shield for package stress sensitive devices
US-9355968-B2 · May 31, 2016 · US
Electrical device, system and method for operating with reduced acoustic noise generation
US-9337011-B2 · May 10, 2016 · US
Stress relief structures in package assemblies
US-9312193-B2 · Apr 12, 2016 · US
Method for housing an electronic component in a device package and an electronic component housed in the device package
US-9312212-B2 · Apr 12, 2016 · US
Semiconductor package and related method
US-2016093576-A1 · Mar 31, 2016 · US
Semiconductor packaging having warpage control and methods of forming same
US-2016079135-A1 · Mar 17, 2016 · US
Stiffener with embedded passive components
US-9275876-B2 · Mar 1, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/16?
- CPC H01L23/16 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/16 (Electricity)?
- Our database includes 853 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/16 growing?
- Publication counts under this code: 75 in 2024 vs 75 in 2025 (latest complete years).