Semiconductor assembly having a housing

Patent metadata

Field	Value
Publication number	US-9373563-B2
Application number	US-78079007-A
Country	US
Kind code	B2
Filing date	Jul 20, 2007
Priority date	Jul 20, 2007
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.

First claim

What is claimed is:

1. A semiconductor assembly comprising:
a housing comprising an inner housing comprising a cover and a peripheral rim; and
at least one pressure element including a frame arranged adjacent a side-face of the peripheral rim, the inner housing being arranged within the frame, the pressure element being resiliently coupled to the inner housing by a plurality of resilient coupling members, and where the pressure element, the inner housing, and the resilient coupling members are provided in the form of a single plastic part.

2. The assembly of claim 1 , comprising:
an electrically insulating substrate.

3. The assembly of claim 1 , comprising wherein the resilient coupling members are provided by various resilient elements, strips, cantilevers, or hollow sections.

4. The assembly of claim 1 , comprising wherein an upper surface of the pressure element protrudes beyond an upper surface of the inner housing.

5. The assembly of claim 1 , comprising wherein the frame is arranged generally concentrically outside of an outer side-face of the peripheral rim of the inner housing and is spaced at a distance from the outer side-face of the inner housing.

6. The assembly of claim 1 , comprising wherein the cover further includes a first through-hole, the first through-hole being adapted to provide a guide for a screw with which the housing is fastenable to a heat sink.

7. The assembly of claim 6 , comprising wherein the cover further comprises a plurality of second through-holes, each second through-hole being adapted to provide a guide for a force fitted contact pin.

8. The assembly of claim 1 , wherein
the cover is generally planar; and
the peripheral rim extends from a lower surface of the cover and is oriented generally perpendicular to the cover such that the side face of the peripheral rim is perpendicular to the cover.

9. A power semiconductor module, comprising:
an electrically insulating substrate comprising an electrically insulating body having a first primary surface and a second primary surface;
at least one power semiconductor component mounted on the first primary surface of the electrically insulating substrate, and
a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element including a pressure element frame arranged adjacent a side-face of the peripheral rim, the inner housing being arranged within the pressure element frame, the pressure element being resiliently coupled to the inner housing by a plurality of resilient coupling members, and where the pressure element, the inner housing, and the resilient coupling members are provided in the form of a single plastic part.

10. A power semiconductor module, comprising:
an electrically insulating substrate comprising an electrically insulating body having a first primary surface and a second primary surface;
at least one power semiconductor component mounted on the first primary surface of the, electrically insulating substrate, and
a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element including a pressure element frame arranged adjacent a side-face of the peripheral rim, the inner housing being arranged within the pressure element frame, the pressure element being resiliently coupled to the inner housing; and
comprising wherein the housing is configured such that in an unattached condition, a lower surface of the peripheral rim of the inner housing is arranged in contact with a first primary surface of the electrically insulating substrate and the at least one pressure element is arranged adjacent a side-face of the electrically insulating substrate and is adjacent and spaced at a distance from a surface to which the attachment of the housing and the electrically insulating substrate is to be detachedly attached.

11. The power semiconductor module of claim 9 , comprising wherein the housing is configured such that in an attached condition, the lower surface of the peripheral rim of the inner housing is in contact with the first primary surface of the electrically insulating substrate and the at least one pressure element is arranged adjacent a side-face of the electrically insulating substrate and in contact with a surface to which the housing and a second primary surface of the electrically insulating substrate is attached as a result of pressure exerted on the upper surface of the pressure element.

12. The power semiconductor module of claim 9 , comprising wherein the pressure element is resiliently coupled to the inner housing by a plurality of resilient strips.

13. The power semiconductor module of claim 9 , comprising wherein the pressure element frame is arranged generally concentrically outside of an outer side-face of the peripheral rim of the inner housing and is spaced at a distance from the outer side-face of the inner housing.

14. The power semiconductor module of claim 9 , further comprising:
a pressure plate and fastening mechanism.

15. The power semiconductor module of claim 14 , comprising wherein the pressure plate is arranged on an upper surface of the pressure element of the housing.

16. The power semiconductor module of claim 14 , comprising wherein the fastening mechanism is arranged so that the pressure plate exerts a force on the pressure element so as to attach the housing and the electrically insulating substrate to a surface.

17. A power semiconductor module comprising:
an electrically insulating substrate;
at least one power semiconductor component arranged on the electrically insulating substrate;
a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element including a frame arranged adjacent a side-face of the peripheral rim, the inner housing being arranged within the frame, the pressure element being resiliently coupled to the inner housing;
a pressure plate being arranged on a printed circuit board at least in regions directly above the pressure element, and
fastening means for exerting pressure on the pressure element so as to attach the housing and the electrically insulating substrate to a surface.

18. The power semiconductor module of claim 17 , comprising wherein the pressure element is resiliently coupled to the inner housing by a plurality of various resilient elements or strips.

19. The power semiconductor module of claim 17 , comprising wherein the pressure element is the frame arranged generally concentrically outside of an outer side-face of the peripheral rim of the inner housing and is spaced at a distance from the outer side-face of the inner housing.

20. The power semiconductor module of claim 17 , comprising wherein the printed circuit board is electrically connected to the at least one power semiconductor component by contact pins extending between the electrically insulating substrate.

21. The power semiconductor module of claim 17 , wherein the pressure plate further comprises a plurality of cutouts, each cutout being adapted to accommodate an end of contact pin.

22. A semiconductor assembly comprising:
a housing comprising an inner housing comprising a cover and a peripheral rim, and wherein the cover and the peripheral rim of the inner housing are made of one piece; and
at least one pressure element including a frame arranged adjacent a side-face of the peripheral rim, the inner housing being arranged within the frame, the pressure element being resiliently coupled to the inner h

Assignees

• Stolze Thilo
• Infineon Technologies Ag

Inventors

• Stolze Thilo

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W90/737

  between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title