Method for housing an electronic component in a device package and an electronic component housed in the device package

Patent metadata

Field	Value
Publication number	US-9312212-B2
Application number	US-201313937082-A
Country	US
Kind code	B2
Filing date	Jul 8, 2013
Priority date	Jul 16, 2008
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

A method for housing an electronic component in a device package includes providing a first substrate, wherein the electronic component is arranged in a component area on a first main surface of the first substrate, and wherein first contact pads are arranged outside of the component area, forming an open top frame structure around the component area on the first main surface of the first substrate, providing a second substrate having second contact pads, arranged symmetrically to the first contact pads and electrically and mechanically connecting the first main surface of the first substrate with the first main surface of the second substrate, so that the frame structure and the second substrate from a cavity or recess around the electronic component on the first substrate.

First claim

What is claimed is:

1. An electronic device package comprising:
a first substrate;
an electronic component arranged in a component area on a first main surface of the first substrate, and wherein first contact pads, electronically coupled to the electronic component, are arranged on the first main surface and outside of the component area;
a second substrate comprising second contact pads, wherein the second contact pads are arranged on a first main surface of the second substrate and symmetrically to the first contact pads on the first substrate; and
an open-top frame structure formed around the component area on the first main surface of the first substrate or around a cavity area on the first main surface of the second substrate, the cavity area symmetrically corresponding to the component area on the first main surface of the first substrate,
wherein the first contact pads on the first main surface of the first substrate are electrically and mechanically connected by a solder material with the second contact pads on the first main surface of the second substrate, so that the open-top frame structure and the second substrate form a cavity or recess around the electronic component on the first substrate.

2. The electronic device package according to claim 1 , wherein the first substrate is electrically and mechanically connected to the second substrate by using a flip-chip mounting and by using a reflowed solder material applied to the first contact pads of the first substrate or to the second contact pads of the second substrate.

3. The electronic device package according to claim 1 , wherein the electronic component is a bulk acoustic wave element, a surface acoustic wave element or an electromechanical structure.

4. The electronic device package according to claim 1 , wherein the open-top frame structure has a height ranging from 1 μm to 100 μm and a width-height ratio of 1 to 2.

5. The electronic device package according to claim 1 , wherein the open-top frame structure comprises an outer frame portion and an inner frame portion, a height of the inner frame portion corresponding to a height of the outer frame portion and a width of the inner frame portion corresponding to 20-70 percent of a width of the outer frame portion.

6. The electronic device package according to claim 5 , wherein the outer frame portion is asymmetrically formed.

7. An electronic device package comprising:
a first substrate comprising a component area on a first main surface;
an electronic component disposed on the component area of the first main surface;
first contact pads disposed on the first main surface and outside of the component area, the first contact pads being electronically coupled to the electronic component;
a second substrate comprising second contact pads disposed on a first main surface of the second substrate;
a first open-top frame structure disposed between the first main surface of the first substrate and the first main surface of the second substrate; and
a cavity disposed between the electronic component and the first main surface of the second substrate, the cavity being at least partially surrounded by the first open-top frame structure,
wherein the first contact pads on the first main surface of the first substrate are electrically and mechanically connected by a solder material with the second contact pads on the first main surface of the second substrate.

8. The electronic device package according to claim 7 , wherein the second contact pads overlap with the first contact pads.

9. The electronic device package according to claim 7 , wherein the cavity is symmetrically disposed corresponding to the component area on the first main surface of the first substrate.

10. The electronic device package according to claim 7 , wherein the first open-top frame structure is attached to the first substrate.

11. The electronic device package according to claim 10 , further comprising a second open-top frame structure disposed on the second substrate.

12. The electronic device package according to claim 7 , wherein the first open-top frame structure is attached to the second substrate.

13. The electronic device package according to claim 7 , wherein the first open-top frame structure comprises an outer frame portion and an inner frame portion.

14. The electronic device package according to claim 13 , wherein a height of the inner frame portion corresponding to a height of the outer frame portion.

15. The electronic device package according to claim 13 , wherein a height of the inner frame portion is higher than a height of the outer frame portion.

16. The electronic device package according to claim 13 , wherein a width of the inner frame portion corresponding to 20-70 percent of a width of the outer frame portion.

17. The electronic device package according to claim 7 , further comprising a layer of solder resist disposed on the first main surface of the second substrate and facing the first main surface of the first substrate.

18. The electronic device package according to claim 17 , wherein the layer of solder resist is structured so that at least a portion of the first main surface of the second substrate facing the cavity is not covered by a region of the layer of solder resist.

19. An electronic device package comprising:
a first substrate comprising first contact pads and a component area on a first main surface;
an electronic component disposed over the component area of the first main surface;
a second substrate comprising second contact pads disposed on a first main surface of the second substrate, the first main surface of the first substrate facing the first main surface of the second substrate;
a first open-top frame structure disposed between the first substrate and the second substrate; and
a cavity at least partially surrounded by the first open-top frame structure,
wherein the first contact pads on the first main surface of the first substrate are electrically and mechanically connected by a solder material with the second contact pads on the first main surface of the second substrate.

20. The electronic device package according to claim 19 , wherein the second contact pads overlap with the first contact pads.

21. The electronic device package according to claim 19 , wherein the first open-top frame structure is attached to the first substrate.

22. The electronic device package according to claim 21 , wherein the first open-top frame structure comprises an outer frame portion and an inner frame portion.

23. The electronic device package according to claim 21 , further comprising a second open-top frame structure attached to the second substrate.

24. The electronic device package according to claim 19 , wherein the first open-top frame structure is attached to the second substrate.

Assignees

• Infineon Technologies Ag

Inventors

• Oppermann Klaus-Guenter
• Franosch Martin
• Gebauer Bernhard

Classifications

• H03H9/105

  the enclosure being defined by a cover cap mounted on an element forming part of the BAW device · CPC title

• H03H9/1007

  for bulk acoustic wave [BAW] devices · CPC title

• H03H9/1085

  the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title