Compact power converter with transistors thermally and electrically connected to a fluid cooled bus bar
US-2024348164-A1 · Oct 17, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/02 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 270 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 15 |
| 2017 | 22 |
| 2018 | 31 |
| 2019 | 33 |
| 2020 | 42 |
| 2021 | 35 |
| 2022 | 22 |
| 2023 | 17 |
| 2024 | 12 |
| 2025 | 17 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Distribution and stabilization of fluid flow for interlayer chip cooling
US-9847275-B2 · Dec 19, 2017 · US
Electronic unit
US-2017347491-A1 · Nov 30, 2017 · US
Methods and devices for fabricating and assembling printable semiconductor elements
US-2017309733-A1 · Oct 26, 2017 · US
Magnetic alignment for flip chip microelectronic devices
US-2017278783-A1 · Sep 28, 2017 · US
Methods and devices for fabricating and assembling printable semiconductor elements
US-9768086-B2 · Sep 19, 2017 · US
Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect
US-9748218-B1 · Aug 29, 2017 · US
High power radio frequency amplifier architecture
US-9742445-B1 · Aug 22, 2017 · US
Sensor assembly
US-9709687-B2 · Jul 18, 2017 · US
Magnetic alignment for flip chip microelectronic devices
US-9711443-B2 · Jul 18, 2017 · US
Solid state drive optimized for wafers
US-2017186731-A1 · Jun 29, 2017 · US
Distribution and stabilization of fluid flow for interlayer chip cooling
US-2017179002-A1 · Jun 22, 2017 · US
Semiconductor device
US-9666518-B1 · May 30, 2017 · US
Semiconductor module
US-2017141012-A1 · May 18, 2017 · US
Magnetic alignment for flip chip microelectronic devices
US-2017141021-A1 · May 18, 2017 · US
High-bandwidth memory application with controlled impedance loading
US-2017133081-A1 · May 11, 2017 · US
Emergency destruction of integrated circuits
US-9627333-B1 · Apr 18, 2017 · US
Substrate sprayer
US-2017084514-A1 · Mar 23, 2017 · US
Power electronic subassembly with capacitor
US-2017055366-A1 · Feb 23, 2017 · US
Semiconductor device and manufacturing method of semiconductor device
US-9576913-B2 · Feb 21, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/02?
- CPC H01L23/02 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/02 (Electricity)?
- Our database includes 270 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/02 growing?
- Publication counts under this code: 12 in 2024 vs 17 in 2025 (latest complete years).