Magnetic alignment for flip chip microelectronic devices

Patent metadata

Field	Value
Publication number	US-9711443-B2
Application number	US-201514941571-A
Country	US
Kind code	B2
Filing date	Nov 14, 2015
Priority date	Nov 14, 2015
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.

First claim

What is claimed is:

1. A microelectronic structure, comprising:
a microelectronic device having an attachment surface, an opposing back surface, and at least one side extending between the attachment surface and the back surface, wherein the microelectronic device attachment surface has at least one magnetic alignment structure and at least one interconnect structure extending therefrom;
a microelectronic substrate having a first surface and having an alignment coil formed therein, and having an unfilled opening extending into the microelectronic substrate from the microelectronic substrate first surface, wherein the unfilled opening is defined by at least one sidewall and a bottom and wherein a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening sidewalk; and
wherein the at least one microelectronic device interconnect structure is electrically attached to the microelectronic substrate.

2. The microelectronic structure of claim 1 , further including an alignment detection coil formed within the microelectronic substrate.

3. The microelectronic structure of claim 2 , wherein at least a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening bottom.

4. The microelectronic structure of claim 1 , wherein a height of the at least one magnetic alignment structure is substantially the same as a height of the at least one interconnect structure.

5. The microelectronic structure of claim 1 , wherein a height of the at least one magnetic alignment structure is greater than a height of the at least one interconnect structure.

6. The microelectronic structure of claim 1 , wherein the at least one magnetic alignment structure is positioned adjacent the at least one microelectronic device side.

7. The microelectronic structure of claim 1 , wherein the microelectronic device further comprises at least one corner, wherein the at least one magnetic alignment structure comprises at least two magnetic alignment structures, and wherein a distance between one of the at least two magnetic alignment structures and the at least one microelectronic device corner closest thereto is greater than a distance between the other of the at least two magnetic alignment structures and the at least one microelectronic device corner closest thereto.

8. The microelectronic structure of claim 1 , wherein the at least one magnetic alignment structure comprises a ferromagnetic material.

9. The microelectronic structure of claim 8 , wherein the ferromagnetic material comprises nickel.

10. An electronic system, comprising:
a housing;
a microelectronic substrate within the housing having a first surface and having an alignment coil formed therein and having an unfilled opening extending into the microelectronic substrate from the microelectronic substrate first surface, wherein the unfilled opening is defined by at least one sidewall and a bottom and wherein a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening sidewall;
a microelectronic device having an attachment surface, wherein the microelectronic device attachment surface has at least one magnetic alignment structure and at least one interconnect structure extending from the attachment surface of the microelectronic device; and
wherein the at least one microelectronic device interconnect structure is electrically attached to the microelectronic substrate first surface.

11. The electronic system of claim 10 , further including an alignment detection coil formed within the microelectronic substrate.

12. The electronic system of claim 11 , wherein at least a portion of the alignment detection coil is exposed to the unfilled opening at the least one unfilled opening bottom.

13. The electronic system of claim 10 , wherein a height of the at least one magnetic alignment structure is substantially the same as a height of the at least one interconnect structure.

14. The electronic system of claim 10 , wherein a height of the at least one magnetic alignment structure is greater than a height of the at least one interconnect structure.

15. The electronic system of claim 10 , wherein the at least one magnetic alignment structure is positioned adjacent at least one side of the microelectronic device.

16. The electronic system of claim 10 , wherein the microelectronic device further comprises at least one corner, wherein the at least one magnetic alignment structure comprises at least two magnetic alignment structures, and wherein a distance between one of the at least two magnetic alignment structures and the at least one microelectronic device corner closest thereto is greater than a distance between the other of the at least two magnetic alignment structures and the at least one microelectronic device corner closest thereto.

17. The electronic system of claim 10 , wherein the at least one magnetic alignment structure comprises a ferromagnetic material.

18. The electronic system of claim 17 , wherein the ferromagnetic material comprises nickel.

19. The electronic system of claim 10 , wherein the at least one magnetic alignment structure comprises a projection capped with a magnetic material.

20. The electronic system of claim 10 , wherein the interconnect structure comprise a pillar having a layer of solder material disposed thereon.

21. The microelectronic structure of claim 1 , wherein the at least one magnetic alignment structure comprises a projection capped with a magnetic material.

22. The microelectronic structure of claim 1 , wherein the interconnect structure comprise a pillar having a layer of solder material disposed thereon.

Assignees

• Intel Corp

Inventors

• Agrawal Ankur
• Moola Srinivas S
• Sharan Sujit
• Govindarajan Vijay

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07227

  involving guiding structures, e.g. spacers or supporting members · CPC title

• H10W72/07223

  Active alignment, e.g. using optical alignment using marks or sensors · CPC title

• H10W72/07221

  Aligning · CPC title

• H10W72/285

  Alignment aids, e.g. alignment marks · CPC title