Semiconductor structure and manufacturing method for the same
US-2019393186-A1 · Dec 26, 2019 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/8181 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 122 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 11 |
| 2017 | 18 |
| 2018 | 10 |
| 2019 | 17 |
| 2020 | 12 |
| 2021 | 13 |
| 2022 | 6 |
| 2023 | 7 |
| 2024 | 9 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Embedded trace substrate structure and semiconductor package structure including the same
US-10483196-B2 · Nov 19, 2019 · US
Conductive ball and electronic device
US-10446512-B2 · Oct 15, 2019 · US
Solderless Interconnection Structure and Method of Forming Same
US-2019295971-A1 · Sep 26, 2019 · US
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
US-10396269-B2 · Aug 27, 2019 · US
Solderless interconnection structure and method of forming same
US-10319691-B2 · Jun 11, 2019 · US
Interconnect structures with intermetallic palladium joints and associated systems and methods
US-10256216-B2 · Apr 9, 2019 · US
Forming a solder joint between metal layers
US-10252363-B2 · Apr 9, 2019 · US
Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
US-10242968-B2 · Mar 26, 2019 · US
Interconnect structures with intermetallic palladium joints and associated systems and methods
US-10224313-B2 · Mar 5, 2019 · US
Micro-transfer printing with volatile adhesive layer
US-10157880-B2 · Dec 18, 2018 · US
Mechanisms for forming package structure
US-10128226-B2 · Nov 13, 2018 · US
Interconnect structures and methods for fabricating interconnect structures
US-10121754-B2 · Nov 6, 2018 · US
Materials for use with interconnects of electrical devices and related methods
US-10123430-B2 · Nov 6, 2018 · US
Multi-strike process for bonding packages and the packages thereof
US-10068868-B2 · Sep 4, 2018 · US
Structures having a tapering curved profile and methods of making same
US-10008459-B2 · Jun 26, 2018 · US
Bump structure and method of forming same
US-9966346-B2 · May 8, 2018 · US
Semiconductor device and method for manufacturing the same
US-9960136-B2 · May 1, 2018 · US
Conductive contacts having varying widths and method of manufacturing same
US-9953939-B2 · Apr 24, 2018 · US
Semiconductor device assemblies including intermetallic compound interconnect structures
US-9881886-B2 · Jan 30, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/8181?
- CPC H01L2224/8181 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/8181 (Electricity)?
- Our database includes 122 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/8181 growing?
- Publication counts under this code: 9 in 2024 vs 6 in 2025 (latest complete years).