Flip-chip mounting structure and flip-chip mounting method
US-2024387444-A1 · Nov 21, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/293 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 263 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 32 |
| 2016 | 38 |
| 2017 | 60 |
| 2018 | 39 |
| 2019 | 33 |
| 2020 | 25 |
| 2021 | 8 |
| 2022 | 7 |
| 2023 | 5 |
| 2024 | 9 |
| 2025 | 5 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated electronic device with transceiving antenna and magnetic interconnection
US-9530743-B2 · Dec 27, 2016 · US
Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
US-9530719-B2 · Dec 27, 2016 · US
Semiconductor module package and method of manufacturing the same
US-9524929-B2 · Dec 20, 2016 · US
Semiconductor device package including bonding layer having Ag3Sn
US-9520377-B2 · Dec 13, 2016 · US
Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
US-9508648-B2 · Nov 29, 2016 · US
Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same
US-2016340558-A1 · Nov 24, 2016 · US
Assembly bonding
US-9488853-B2 · Nov 8, 2016 · US
Electronic apparatus and method for fabricating the same
US-9490232-B2 · Nov 8, 2016 · US
Method and apparatus for multi-chip structure semiconductor package
US-9466588-B2 · Oct 11, 2016 · US
Electronic component assembly
US-9426899-B2 · Aug 23, 2016 · US
Stacked synchronous buck converter having chip embedded in outside recess of leadframe
US-9425132-B2 · Aug 23, 2016 · US
Laser die backside film removal for integrated circuit (IC) packaging
US-9412702-B2 · Aug 9, 2016 · US
Joining method, method for producing electronic device and electronic part
US-9409247-B2 · Aug 9, 2016 · US
Semiconductor module
US-9402311-B2 · Jul 26, 2016 · US
Reconstituted wafer-level package DRAM
US-9391008-B2 · Jul 12, 2016 · US
Anisotropic conductive film and manufacturing method therefor
US-2016155717-A1 · Jun 2, 2016 · US
Semiconductor device
US-9331036-B2 · May 3, 2016 · US
Semiconductor device connected by anisotropic conductive film
US-9331044-B2 · May 3, 2016 · US
Thermal management in electronic devices with yielding substrates
US-9324930-B2 · Apr 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/293?
- CPC H01L2224/293 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/293 (Electricity)?
- Our database includes 263 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/293 growing?
- Publication counts under this code: 9 in 2024 vs 5 in 2025 (latest complete years).