Joining method, method for producing electronic device and electronic part

Patent metadata

Field	Value
Publication number	US-9409247-B2
Application number	US-201414460519-A
Country	US
Kind code	B2
Filing date	Aug 15, 2014
Priority date	Mar 5, 2012
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

First claim

The invention claimed is:

1. A joining method for joining a first metal member having a first metal to a second metal member having a second metal by using a joining material predominantly composed of a low melting point metal having a lower melting point than the first metal and/or the second metal, wherein
the low melting point metal composing the joining material is Sn or an alloy containing Sn,
at least one of the first metal and the second metal is predominantly composed of a Cu—Al alloy that contains 5 to 30% by weight of Al, and
the joining method comprises heat-treating the first metal member and the second metal member with the joining material located therebetween at a temperature at which the low melting point metal melts to join the first metal member to the second metal member with a joint portion interposed between the first metal member and the second metal member, the joint portion including an intermetallic compound produced by a reaction of the low melting point metal with the Cu—Al alloy of the first metal and/or the second metal.

2. The joining method according to claim 1 , wherein the heat-treating includes reflowing the joining material at 250° C. for 30 minutes under a load.

3. The joining method according to claim 1 , wherein the heat-treating includes a first heating of reflowing the joining material at 250° C. for 15 minutes under a load to melt the low melting point metal, and a second heating at 250° C. for 15 minutes such that the low melting point metal composing the joining material is melted and reacted with the first metal and/or the second metal to produce the intermetallic compound.

4. A method for producing an electronic device, the method comprising joining the first metal member to the second metal member by the joining method according to claim 1 .

5. An electronic part comprising:
an electrode joined to a joining material including a low melting point metal composed of Sn or an alloy containing Sn, wherein the electrode joined to the joining material includes a Cu—Al alloy that contains 5 to 30% by weight of Al.

Assignees

• Murata Manufacturing Co

Inventors

• Nakano Kosuke
• Takaoka Hidekiyo

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title