Laser die backside film removal for integrated circuit (IC) packaging

Patent metadata

Field	Value
Publication number	US-9412702-B2
Application number	US-201313830126-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

First claim

What is claimed is:

1. A package assembly comprising:
a die with a first side and a second side opposite to the first side, the second side having one or more transistors;
a substrate; and
an adhesive layer disposed on the first side of the die between the die and the substrate, the adhesive layer comprising a polymer matrix, the polymer matrix including a plurality of polymer chains and a plurality of nanoparticles dispersed within the polymer matrix, the nanoparticles comprising a phase transition material, wherein the polymer chains are larger than the nanoparticles, wherein the adhesive layer is transparent to a first wavelength of light and photoreactive to a second wavelength of light, wherein the first side of the die is substantially opaque to the first wavelength of light, and wherein the adhesive layer is to exhibit a change in color or transparency in response to laser energy having the second wavelength.

2. The package assembly of claim 1 , wherein the adhesive layer is a film comprising a thermochromic dye.

3. The package assembly of claim 1 , wherein the phase transition material is vanadium dioxide.

4. The package assembly of claim 1 , wherein the first wavelength is a wavelength in a range of 390-740 nm and the second wavelength is a wavelength in a range of 10-390 nm or 740-3000 nm.

5. The package assembly of claim 1 , wherein the adhesive layer secures the die to the substrate.

6. The package assembly of claim 1 , wherein the adhesive layer is bonded to the substrate.

7. The package assembly of claim 1 , wherein the nanoparticles have diameters between approximately 1 nanometer and approximately 10 nanometers.

8. The package assembly of claim 1 , wherein the nanoparticles induce space constraints in the polymer matrix that prevent alignment of the polymer chains to form large crystal structures at the first wavelength of light that would cause the change in color or transparency of the adhesive layer.

9. The package assembly of claim 1 , wherein the nanoparticles are to agglomerate in response to the laser energy having the second wavelength.

10. The package assembly of claim 9 , wherein the agglomeration of the nanoparticles causes the change in color or transparency of the adhesive layer.

11. The package assembly of claim 9 , wherein the polymer chains align to form large crystal structures in response to the agglomeration of the nanoparticles, wherein the alignment of the polymer chains to form the large crystal structures decreases transparency of the adhesive layer.

12. The package assembly of claim 1 , wherein the nanoparticles convert light applied to the adhesive layer to heat, wherein the nanoparticles produce at least a specific heat in response to application of the second wavelength of light to the adhesive layer, and wherein the polymer matrix is to foam or carbonize in response to application of at least the specific heat produced by the nanoparticles.

Assignees

• Intel Corp

Inventors

• Faruqui Danish
• Prack Edward R
• Voronov Sergei L
• Wilkinson David K
• Dambrauskas Tony
• Skoglund Lars D
• Tomita Yoshihiro
• Oka Mihir A
• Dias Rajen C

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title