Electronic component assembly

Patent metadata

Field	Value
Publication number	US-9426899-B2
Application number	US-43960208-A
Country	US
Kind code	B2
Filing date	Apr 24, 2008
Priority date	Apr 27, 2007
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.

First claim

The invention claimed is:

1. An electronic component assembly comprising:
a first electronic component including a plurality of first electrodes provided on a first surface of the first electronic component;
a second electronic component including a plurality of second electrodes provided on a first surface of the second electronic component;
a resin including a solder powder provided on the first surface of the electronic component between the first electronic component and the second electronic component;
solder connections disposed between the first electrodes on the first surface of the first electronic component and the second electrodes on the first surface of the second electronic component to electrically interconnect the first electrodes on the first electronic component and the second electrodes on the second electronic component; and
at least one recessed portion in the first surface of the first electronic component, the recessed portion being free of solder material, and the recessed portion being located in an area of the first surface of the first electronic component that is not occupied by the first electrodes and is adjacent to the first electrodes,
wherein the at least one recessed portion is provided for bubble generation and has a tapered shape with a taper angle of less than 90 degrees.

2. The electronic component assembly according to claim 1 , wherein the at least one recessed portion is constructed in the form of a groove.

3. The electronic component assembly according to claim 1 , wherein the at least one recessed portion is formed in a central region of the first surface of the first electronic component between adjacent ones of the first electrodes.

4. The electronic component assembly according to claim 1 , wherein the first surface of the second electronic component includes at least one recessed portion located in an area of the first surface of the second electronic component that is not occupied by the second electrodes.

5. The electronic component assembly according to claim 4 , wherein the recessed portion in the first surface of the second electronic component is located in a central region between adjacent ones of the second electrodes.

6. The electronic component assembly according to claim 1 , wherein the at least one recessed portion is constructed in the form of an elongated groove.

7. An electronic component assembly comprising:
a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component;
a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component;
a resin including a solder powder provided between the first electronic component and the second electronic component;
solder connections disposed between the first electrodes on the first major surface of the first electronic component and the second electrodes on the first major surface of the second electronic component to electrically interconnect the first electrodes on the first electronic component and the second electrodes on the second electronic component; and
the first major surface of the first electronic component having an elongated groove positioned parallel to the first major surface of the first electronic component, wherein the elongated groove is provided for bubble generation and is free of solder material, and the elongated groove is located in an area of the first surface of the first electronic component that is not occupied by the first electrodes and is adjacent to the first electrodes.

Assignees

• Kitae Takashi
• Nakatani Seiichi
• Karashima Seiji
• Panasonic Ip Man Co Ltd

Inventors

• Kitae Takashi
• Nakatani Seiichi
• Karashima Seiji

Classifications

• H05K2201/10977

  Encapsulated connections · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K2203/083

  Evaporation or sublimation of a compound, e.g. gas bubble generating agent · CPC title

• H05K2203/087

  Using a reactive gas · CPC title