Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor Device
US-2024312825-A1 · Sep 19, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/681 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,293 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 36 |
| 2016 | 63 |
| 2017 | 99 |
| 2018 | 88 |
| 2019 | 136 |
| 2020 | 169 |
| 2021 | 125 |
| 2022 | 137 |
| 2023 | 131 |
| 2024 | 137 |
| 2025 | 144 |
| 2026 | 28 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and System for Positioning Center of V-Type Notch of Wafer, and Computer Storage Medium
US-2024266198-A1 · Aug 8, 2024 · US
SiC EPITAXIAL WAFER AND METHOD FOR PRODUCING SAME, AND DEVICE FOR PRODUCING SiC EPITAXIAL WAFER
US-2016379860-A1 · Dec 29, 2016 · US
Process apparatus with on-the-fly substrate centering
US-9514974-B2 · Dec 6, 2016 · US
Mounting apparatus and method of correcting offset amount of the same
US-2016351528-A1 · Dec 1, 2016 · US
Bonding method, bonding apparatus, and bonding system
US-9486989-B2 · Nov 8, 2016 · US
Device for alignment of two substrates
US-2016322249-A1 · Nov 3, 2016 · US
Exposure method, exposure apparatus, and device manufacturing method
US-9477155-B2 · Oct 25, 2016 · US
Apparatus for detecting a pre-aligning element at a wafer
US-9476701-B2 · Oct 25, 2016 · US
Method and apparatus for direct formation of nanometer scaled features
US-9466500-B2 · Oct 11, 2016 · US
Cutting device and cutting method
US-2016284612-A1 · Sep 29, 2016 · US
Systems and methods for fabricating and orienting semiconductor wafers
US-9449864-B2 · Sep 20, 2016 · US
Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
US-9448065-B2 · Sep 20, 2016 · US
Detection Device
US-2016260629-A1 · Sep 8, 2016 · US
Substrate Detection Apparatus, Substrate Detection Method and Substrate Processing System
US-2016240412-A1 · Aug 18, 2016 · US
Device and method for aligning substrates
US-9418882-B2 · Aug 16, 2016 · US
Systems and methods of controlling semiconductor wafer fabrication processes
US-9368379-B2 · Jun 14, 2016 · US
Mark detecting method
US-9360773-B2 · Jun 7, 2016 · US
Robot positioning system for semiconductor tools
US-9352466-B2 · May 31, 2016 · US
Device and method for aligning substrates
US-2016148826-A1 · May 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/681?
- CPC H01L21/681 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/681 (Electricity)?
- Our database includes 1,293 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/681 growing?
- Publication counts under this code: 137 in 2024 vs 144 in 2025 (latest complete years).