Apparatus for detecting a pre-aligning element at a wafer

Patent metadata

Field	Value
Publication number	US-9476701-B2
Application number	US-201313936050-A
Country	US
Kind code	B2
Filing date	Jul 5, 2013
Priority date	Jul 5, 2013
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

An apparatus detects a pre-aligning element at a wafer. The wafer has the pre-aligning element at a wafer edge. The apparatus includes a sensor arrangement and an evaluation unit. The sensor arrangement is configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of the illumination from the illuminated edge portions with an illumination sensor, and to output a first and a second sensor signal. The first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination. The evaluation unit is configured to evaluate the first sensor signal and to determine a first position information with respect to a coarse position of the pre-aligning element if the first sensor signal indicates that the transmitted fractions of the illumination has reached a predetermined threshold value.

First claim

What is claimed is:

1. An apparatus for detecting a pre-aligning element at a wafer, the wafer having the pre-aligning element at a wafer edge, the apparatus comprising:
a sensor arrangement configured to illuminate subsequent edge portions of the wafer edge, to receive transmitted fractions and reflected fractions of an illumination from the illuminated edge portions, and to output a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination, wherein the first sensor signal indicates a degree of measured intensity or brightness of the transmitted fraction of the illumination, and wherein the second sensor signal comprises a video frame or a picture; and
an evaluation unit comprising a programmable logic device and configured to evaluate the first sensor signal and to determine a first position information indicating a coarse position of the pre-aligning element within the currently evaluated edge portion, when the first sensor signal indicates that the transmitted fractions of the illumination have reached a predetermined threshold value, wherein the first position information indicates that the pre-aligning element is located within the currently evaluated edge portion, and, after having determined the first position information, to determine a second position information based on the second sensor signal and the first position information, wherein the second position information indicates a fine position of the pre-aligning element, and wherein the second position information gives a more accurate information about the exact position of the pre-aligning element when compared to the first position information.

2. The apparatus according to claim 1 , wherein the sensor arrangement comprises a first illumination sensor configured to sense the transmitted fractions of the illumination, a second illumination sensor configured to sense the reflected fractions of the illumination, and an illumination source configured to illuminate the subsequent edge portions of the wafer edge, wherein the illumination source and the second illumination sensor are arranged on the same side of the wafer, and wherein the first illumination sensor is arranged at an opposing side of the wafer.

3. The apparatus according to claim 1 , wherein the sensor arrangement comprises an illumination sensor configured to sense the transmitted fractions and the reflected fractions of the illumination, a first illumination source configured to illuminate the wafer edge for creating the transmitted fractions of the illumination and a second illumination source configured to illuminate the wafer edge for creating the reflected fractions of the illumination, wherein the second illumination source and the illumination sensor are arranged at the same side of the wafer, and wherein the first illumination source is arranged at an opposing side of the wafer.

4. The apparatus according to claim 1 , wherein the sensor arrangement comprises a first illumination sensor configured to sense the transmitted fractions of the illumination, a second illumination sensor configured to sense the reflected fractions of the illumination, a first illumination source configured to illuminate the wafer edge for creating the transmitted fractions of the illumination and a second illumination source configured to illuminate the wafer edge for creating the reflected fractions of the illumination, wherein the first and the second illumination sensor are arranged at the same side of the wafer and wherein the first illumination source is arranged at one side of the wafer and the second illumination source is arranged at an opposing side of the wafer.

5. The apparatus according to claim 1 , wherein the apparatus is configured to detect the pre-aligning element in form of a notch or a flat at the wafer edge.

6. The apparatus according to claim 1 , wherein the first position information indicates the position of the pre-alignment element within a first range of detection, and wherein the second position information indicates the position of the pre-alignment element within a second range of detection, wherein the second range of detection is equal or smaller than the first range of detection.

7. A pre-alignment system comprising:
an apparatus according to claim 1 , further comprising:
an actuator configured to move the wafer into a pre-alignment position; and
a control unit comprising a programmable logic device and configured to control the actuator for pre-aligning the wafer based on the first and second position information.

8. The pre-alignment system according to claim 7 , wherein
the sensor arrangement comprises a first illumination sensor configured to sense the transmitted fractions of the illumination, a second illumination sensor configured to sense the reflected fractions of the illumination, and an illumination source configured to illuminate the subsequent edge portions of the wafer edge, wherein the illumination source and the second illumination sensor are arranged on the same side of the wafer, and wherein the first illumination sensor is arranged at an opposing side of the wafer.

9. The pre-alignment system according to claim 7 , wherein
the sensor arrangement comprises an illumination sensor configured to sense the transmitted fractions and the reflected fractions of the illumination, a first illumination source configured to illuminate the wafer edge for creating the transmitted fractions of the illumination and a second illumination source configured to illuminate the wafer edge for creating the reflected fractions of the illumination, wherein the second illumination source and the illumination sensor are arranged at the same side of the wafer, and wherein the first illumination source is arranged at an opposing side of the wafer.

10. The pre-alignment system according to claim 7 , wherein
the sensor arrangement comprises a first illumination sensor configured to sense the transmitted fractions of the illumination, a second illumination sensor configured to sense the reflected fractions of the illumination, a first illumination source configured to illuminate the wafer edge for creating the transmitted fractions of the illumination and a second illumination source configured to illuminate the wafer edge for creating the reflected fractions of the illumination, wherein the first and the second illumination sensor are arranged at the same side of the wafer and wherein the first illumination source is arranged at one side of the wafer and the second illumination source is arranged at an opposing side of the wafer.

11. The pre-alignment system according to claim 7 , wherein the first position information indicates the position of the pre-alignment element within a first range of detection, and wherein the second position information indicates the position of the pre-alignment element within a second range of detection, wherein the second range of detection is equal or smaller than the first range of detection.

12. A method for detecting a pre-aligning element at a wafer, the wafer having the pre-aligning element at a wafer edge, the method comprising:
illuminating subsequent edge portions of the wafer edge with a sensor arrangement;
receiving transmitted fractions and reflected fractions of an illumination from the illuminated edge portion with an illumination sensor;
outputting a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination, where

Assignees

• Infineon Technologies Ag

Inventors

• Zell Thomas
• Kittner Horst

Classifications

• H10P72/53 Primary

  using optical controlling means · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• G01B11/272 Primary

  using photoelectric detection means · CPC title

• G01B11/27 Primary

  for testing the alignment of axes {(means for centering or aligning a light guide within a ferrule G02B6/3834)} · CPC title