Bonding method, bonding apparatus, and bonding system

Patent metadata

Field	Value
Publication number	US-9486989-B2
Application number	US-201414274895-A
Country	US
Kind code	B2
Filing date	May 12, 2014
Priority date	May 16, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A bonding method includes: holding a substrate to be processed by a first holding unit; holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate thereon or in a second holding state of electrostatically attracting the glass substrate; depressurizing the interior of a chamber; and bringing the substrate to be processed and the glass substrate into contact with each other and pressing them. Holding a glass substrate includes: switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing in depressurizing the interior of a chamber and a pressing timing in bonding the substrate to be processed and the glass substrate.

First claim

What is claimed is:

1. A bonding method, comprising:
holding a substrate to be processed by a first holding unit;
holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate on the second holding unit or in a second holding state of electrostatically attracting the glass substrate toward the second holding unit;
depressurizing the interior of a chamber for accommodating the substrate to be processed held by the first holding unit and the glass substrate held by the second holding unit; and
bringing the substrate to be processed and the glass substrate into contact with each other and pressing the substrate to be processed and the glass substrate to bond the substrate to be processed and the glass substrate,
wherein depressurizing the interior of a chamber includes:
a first depressurizing process of depressurizing the interior of the chamber to a first pressure using a first intake device, and, after the first depressurizing;
a second depressurizing process of depressurizing the interior of the chamber to a second pressure lower than the first pressure using a second intake device, and

wherein holding a glass substrate includes:
switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including both a pressure change timing at which the pressure within the chamber is changed in the first depressurizing process and a pressure change timing at which the pressure within the chamber is changed in the second depressurizing process, and a pressing timing at which the substrate to be processed and the glass substrate are pressed in bonding the substrate to be processed and the glass substrate.

2. The bonding method of claim 1 , wherein holding a glass substrate includes:
starting the second holding state before the pressure change timings and the pressing timing.

3. The bonding method of claim 1 , wherein depressurizing the interior of a chamber includes:
starting the depressurization of the interior of the chamber before the pressing timing and stopping the depressurization of the interior of the chamber at the pressing timing.

4. The bonding method of claim 1 , further comprising:
heating the substrate to be processed and the glass substrate.

5. A bonding method, comprising:
holding a substrate to be processed by a first holding unit;
holding a glass substrate by a second holding unit in a first holding state of seating the glass substrate on the second holding unit or in a second holding state of electrostatically attracting the glass substrate toward the second holding unit;
depressurizing the interior of a chamber for accommodating the substrate to be processed held by the first holding unit and the glass substrate held by the second holding unit; and
bringing the substrate to be processed and the glass substrate into contact with each other and pressing the substrate to be processed and the glass substrate to bond the substrate to be processed and the glass substrate,
wherein holding a glass substrate includes:
switching from the first holding state to the second holding state during at least one predetermined period of time selected from a plurality of predetermined periods of time, the plurality of predetermined periods of time including a pressure change timing at which a pressure within the chamber is changed in depressurizing the interior of a chamber, a pressing timing at which the substrate to be processed and the glass substrate are pressed in bonding the substrate to be processed and the glass substrate and a contact timing at which the substrate to be processed and the glass substrate are brought into contact with each other in bonding the substrate to be processed and the glass substrate.

6. The bonding method of claim 5 , wherein holding a glass substrate includes:
starting the second holding state before the pressure change timing, the pressing timing and the contact timing.

7. The bonding method of claim 5 , wherein depressurizing the interior of a chamber includes:
starting the depressurization of the interior of the chamber before the pressing timing and stopping the depressurization of the interior of the chamber at the pressing timing.

8. The bonding method of claim 5 , further comprising:
heating the substrate to be processed and the glass substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Ookawa Satoshi

Classifications

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/72

  using electrostatic chucks · CPC title