Multilayer capacitor and board having the same
US-2017367186-A1 · Dec 21, 2017 · US
leading through the housing, i.e. lead-through
leading through the housing, i.e. lead-through · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G4/236 |
| Official title | leading through the housing, i.e. lead-through |
| Display label | leading through the housing, i.e. lead-through |
| Total patents | 418 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 33 |
| 2017 | 18 |
| 2018 | 40 |
| 2019 | 45 |
| 2020 | 48 |
| 2021 | 46 |
| 2022 | 44 |
| 2023 | 37 |
| 2024 | 31 |
| 2025 | 54 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitor with improved heat dissipation
US-9831035-B2 · Nov 28, 2017 · US
Low inductance capacitor assembly
US-2017338044-A1 · Nov 23, 2017 · US
Case-mold-type capacitor and method for producing same
US-9824823-B2 · Nov 21, 2017 · US
Multilayer ceramic capacitor and method of manufacturing the same
US-2017278637-A1 · Sep 28, 2017 · US
Method of assembling a capacitor assembly
US-9761375-B2 · Sep 12, 2017 · US
Electric power converter
US-9713293-B2 · Jul 18, 2017 · US
Multilayer capacitor and board having the same
US-9706641-B1 · Jul 11, 2017 · US
Control apparatus, connector, and laminated capacitor for connector
US-9705261-B2 · Jul 11, 2017 · US
Electronic component and method of manufacturing electronic component
US-2017162319-A1 · Jun 8, 2017 · US
Multilayer electronic component and manufacturing method therefor
US-2017125167-A1 · May 4, 2017 · US
Film capacitor and manufacturing method therefor
US-2017053744-A1 · Feb 23, 2017 · US
Multilayer ceramic electronic component and board having the same mounted thereon
US-9526174-B2 · Dec 20, 2016 · US
Multi-layer capacitor having upper and lower portions with different dielectric layer materials to reduce acoustic vibration
US-2016351330-A1 · Dec 1, 2016 · US
Multilayer ceramic capacitor
US-9496087-B2 · Nov 15, 2016 · US
Multilayer ceramic electronic component and board having the same
US-9491847-B2 · Nov 8, 2016 · US
Embedded package substrate capacitor with configurable/controllable equivalent series resistance
US-9449762-B2 · Sep 20, 2016 · US
Low Profile Multi-Anode Assembly
US-2016268049-A1 · Sep 15, 2016 · US
Multilayer ceramic component
US-2016268044-A1 · Sep 15, 2016 · US
Film capacitor having a package for heat transfer
US-9439278-B2 · Sep 6, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01G4/236?
- CPC H01G4/236 is the Cooperative Patent Classification code for “leading through the housing, i.e. lead-through.”
- How many patents are filed under CPC H01G4/236 (leading through the housing, i.e. lead-through)?
- Our database includes 418 publications tagged with this CPC code.
- Is patent activity under CPC H01G4/236 growing?
- Publication counts under this code: 31 in 2024 vs 54 in 2025 (latest complete years).