Capacitor with improved heat dissipation

Patent metadata

Field	Value
Publication number	US-9831035-B2
Application number	US-201414529337-A
Country	US
Kind code	B2
Filing date	Oct 31, 2014
Priority date	Oct 31, 2014
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

First claim

The invention claimed is:

1. A capacitor comprising:
a first winding member comprising a first dielectric layer and a first conductive layer, the first conductive layer overlying at least a portion of the first dielectric layer;
a second winding member comprising a second dielectric layer and second conductive layer, the second conductive layer overlying at least a portion of the second dielectric layer, the first winding member interleaved, partially or entirely, with the second winding layer;
a dielectric package for at least radially containing or bordering the first winding member and the second winding member;
a first metallic member having a generally planar, radially extending surface for electrically and mechanically contacting an upper portion of the first conductive layer;
a second metallic member having a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer, wherein the dielectric package has a lower side surface opposite an upper side surface; the lower side surface adjoining or comprising the second metallic member having an exposed exterior surface or a metallic pad;
a first lead coupled to the first metallic layer and extending through an upper side surface, wherein the first lead extends from the upper side to the lower side to terminate in another metallic pad or generally planar lower surfaces substantially parallel or co-planar to the lower side surface; and
a second lead extending through the upper side surface, the second lead spaced apart from the first lead, wherein the second lead is coupled to an upper portion of the first conductive layer via the first metallic member.

2. The capacitor according to claim 1 wherein the first lead has generally planar surfaces parallel to or co-planar to the upper side surface and the lower side surface; and further comprising:
the second lead having generally planar surfaces parallel to or co-planar to the upper side surface and the lower side surface.

3. The capacitor according to claim 1 wherein the second metallic member is substantially planar and wherein there is a dielectric border that is electrically isolated from the second metallic member.

4. The capacitor according to claim 1 wherein the first lead terminates in said another metallic pad for mounting on a circuit board and wherein the second lead terminates in a conductive pad for mounting on the circuit board.

5. The capacitor according to claim 1 wherein the second metallic member extends radially outward from a central axis of the package.

6. The capacitor according to claim 1 wherein the first lead and the second lead extend radially outward diagonally from or near the central axis of the package.

7. The capacitor according to claim 1 wherein each one of the first winding member and the second winding member has a substantially spiral cross-section of its respective conductive layer.

8. The capacitor according to claim 1 wherein the first lead terminates radially outward from the exposed exterior surface.

9. An electronic assembly comprising:
a circuit board having one or more conductive traces;
a capacitor for mounting on the circuit board, the capacitor comprising:
a first winding member comprising a first dielectric layer and a first conductive layer, the first conductive layer overlying the first dielectric layer;
a second winding member comprising a second conductive layer and a second dielectric layer, the second conductive layer overlying the second dielectric layer, the first winding member interleaved, partially or entirely, with the second winding layer;
a dielectric package for containing radially or bordering radially the first winding member and the second winding member, the dielectric package having an upper side surface;
a first metallic member having a generally planar, radially extending surface for electrically and mechanically contacting an upper portion of the first conductive layer;
a second metallic member having a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer, wherein the dielectric package has a lower side surface opposite the upper side surface; the lower side surface adjoining or comprising the second metallic member having an exposed exterior surface or a metallic pad;
a first lead coupled to the first metallic layer and extending through the upper side surface, wherein the first lead extends from the upper side to the lower side to terminate in another metallic pad or generally planar lower surfaces substantially parallel or co-planar to the lower side surface; and
a second lead extending through the upper side surface, the second lead spaced apart from the first lead, wherein the second lead is coupled to an upper portion of the first conductive layer via the first metallic member.

10. The electronic assembly according to claim 9 wherein the first lead has generally planar surfaces parallel to or co-planar to the upper side surface and the lower side surface; the second lead has generally planar surfaces parallel to or co-planar to the upper side surface and the lower side surface.

11. The electronic assembly according to claim 9 wherein the metallic pad of the exposed exterior surface is soldered to a corresponding mounting pad or conductive trace on the circuit board.

12. The electronic assembly according to claim 9 further comprising a plurality of said capacitors that are arranged in one more rows on the circuit board.

13. The electronic assembly according to claim 9 further comprising a first set of said capacitors mounted on a first side of the circuit board and a second set of said capacitors mounted on a second side of the circuit board opposite the first side.

14. The electronic assembly according to claim 13 further comprising:
an enclosure having an first enclosure portion for engaging or contacting first leads and second leads of the first set of capacitors and a second enclosure portion for engaging or contacting first leads and second leads of the second set of capacitors such that heat can axially flow away from the electronic assembly via the enclosure.

15. An electronic assembly comprising:
a circuit board having one or more conductive traces;
a capacitor for mounting on the circuit board, the capacitor comprising:
a first winding member comprising a first dielectric layer and a first conductive layer, the first conductive layer overlying the first dielectric layer;
a second winding member comprising a second conductive layer and a second dielectric layer, the second conductive layer overlying the second dielectric layer, the first winding member interleaved, partially or entirely, with the second winding layer;
a dielectric package for containing radially or bordering radially the first winding member and the second winding member, the dielectric package having an upper side surface;
a first metallic member having a generally planar, radially extending surface for electrically and mechanically contacting an upper portion of the first conductive layer;
a second metallic member having a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer, wherein the dielectric package has a lower side surface opposite the upper side surface; the lower side surface adjoining or comprising the second metallic member having an exposed exterior surface or a metallic pad;
a first lead coupled to the first metallic layer and extending through the upper side surface, wherein the fir

Assignees

• Deere & Co

Inventors

• Schmit Christopher J
• Clements Neal D
• Wieland Andrew D

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H01G4/228

  Terminals · CPC title

• H05K2201/10545

  Related components mounted on both sides of the PCB · CPC title

• H01G4/236

  leading through the housing, i.e. lead-through · CPC title

• H05K2201/10522

  Adjacent components · CPC title