Multilayer ceramic electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-9491847-B2
Application number	US-201514921867-A
Country	US
Kind code	B2
Filing date	Oct 23, 2015
Priority date	Jan 8, 2015
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A multilayer ceramic electronic component includes: a board including first and second contact terminals disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other; a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions disposed on opposite end surfaces of a ceramic body and first and second band portions extending from the first and second connection portions to portions of one surface of the ceramic body and connected to the first and second contact terminals, respectively; a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and first and second connection terminals connecting the ends of the first and second contact terminals to the first and second external terminals, respectively.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a board including first and second contact terminals which are disposed on one surface thereof to be spaced apart from each other in a length direction, and first and second external terminals which are disposed on the other surface thereof to be spaced apart from each other in the length direction;
a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions which are disposed on opposite end surfaces of a ceramic body and first and second band portions which extend from the first and second connection portions to portions of one surface of the ceramic body in a thickness direction thereof, respectively, the first and second band portions being connected to the first and second contact terminals of the board, respectively;
a sealing part enclosing the multilayer ceramic capacitor on the board while exposing one ends of the first and second contact terminals; and
first and second connection terminals connecting the exposed ends of the first and second contact terminals and the first and second external terminals to each other, respectively.

2. The multilayer ceramic electronic component of claim 1 , wherein the first and second connection terminals extend to cover opposite end surfaces of the sealing part, respectively.

3. The multilayer ceramic electronic component of claim 1 , wherein the multilayer ceramic capacitor includes a plurality of first and second internal electrodes stacked in the ceramic body to be alternately exposed through the opposite end surfaces of the ceramic body, respectively, with at least one of dielectric layers interposed therebetween, and connected to the first and second connection portions, respectively.

4. The multilayer ceramic electronic component of claim 1 , further comprising first and second conductive adhesive layers disposed between the first and second contact terminals of the board and the first and second band portions of the first and second external electrodes, respectively.

5. The multilayer ceramic electronic component of claim 1 , further comprising an insulating adhesive layer disposed between the board and one surface of the ceramic body in the thickness direction.

6. The multilayer ceramic electronic component of claim 1 , wherein the first and second band portions of the first and second external electrodes extend from the first and second connection portions to portions of the other surface of the ceramic body in the thickness direction, respectively, and
the multilayer ceramic capacitor comprises a plurality of multilayer ceramic capacitors which are stacked and connected to each other through band portions of external electrodes facing each other.

7. The multilayer ceramic electronic component of claim 6 , wherein the plurality of multilayer ceramic capacitors include conductive adhesive layers between the band portions facing each other.

8. The multilayer ceramic electronic component of claim 6 , wherein the plurality of multilayer ceramic capacitors further include an intermediate board disposed between the band portions facing each other and including contact terminals and external terminals.

9. A multilayer ceramic electronic component comprising:
a board including first and second contact terminals which are disposed on one surface thereof to be spaced apart from each other and first and second external terminals disposed on the other surface thereof to be spaced apart from each other;
a multilayer ceramic capacitor including first and second external electrodes including first and second connection portions which are disposed on opposite side surfaces of a ceramic body and first and second band portions which extend from the first and second connection portions to portions of one surface of the ceramic body in a thickness direction thereof, respectively, the first and second band portions being connected to the first and second contact terminals, respectively;
a sealing part enclosing the multilayer ceramic capacitor the board while exposing one ends of the first and second contact terminals; and
first and second connection terminals connecting the exposed ends of the first and second contact terminals and the first and second external terminals to each other,
respectively.

10. The multilayer ceramic electronic component of claim 9 , wherein the first and second contact terminals include:
first and second mounting portions disposed to be spaced apart from each other and connected to the first and second band portions, respectively;
first and second contact portions exposed to opposite ends of the board, respectively; and
first and second connecting portions connecting the first and second mounting portions and the first and second contact portions to each other, respectively.

11. The multilayer ceramic electronic component of claim 10 , further comprising first and second conductive adhesive layers disposed between the first and second mounting portions of the first and second contact terminals and the first and second band portions of the first and second external electrodes, respectively.

12. The multilayer ceramic electronic component of claim 11 , further comprising an insulating adhesive layer disposed between the board and one surface of the ceramic body in the thickness direction.

13. The multilayer ceramic electronic component of claim 9 , wherein the first and second connection terminals are disposed on opposite end surfaces of the sealing part, respectively.

14. The multilayer ceramic electronic component of claim 9 , wherein the multilayer ceramic capacitor includes a plurality of first and second internal electrodes alternately stacked in the ceramic body to face each other with at least one of dielectric layers interposed therebetween, and
the first and second internal electrodes include first and second body portions overlapping each other and first and second lead portions extending from the first and second body portions to be exposed through opposite side surfaces of the ceramic body and connected to the first and second connection portions of the first and second external electrodes, respectively.

15. A multilayer ceramic electronic component comprising:
a board including an electrically insulating body, first and second contact terminals disposed on one surface of the electrically insulating body, and first and second external terminals disposed on another surface of the electrically insulating body opposite to the one surface;
a multilayer ceramic capacitor disposed on the board and including first and second external electrodes including first and second connection portions which are disposed on opposite end surfaces of a ceramic body and first and second band portions which extend from the first and second connection portions to portions of one surface of the ceramic body, respectively, the first and second band portions being connected to the first and second contact terminals of the board, respectively;
a sealing part; and
first and second connection terminals connecting the first and second contact terminals of the board and the first and second external terminals of the board to each other, respectively,
wherein the multilayer ceramic capacitor is surrounded by the sealing part and the board.

16. The multilayer ceramic electronic component of claim 15 , wherein the first and first and second connection terminals extend from the electrically insulating body of the board to cover opposite side surfaces of the sealing part, respectively.

17. The

Assignees

• Samsung Electro Mech

Inventors

• Park Sang Soo
• Lee Byoung Hwa
• Ahn Young Ghyu
• Park Heung Kil
• Oh Hyun Sub

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W44/601

  Capacitive arrangements (H10W44/20 takes precedence) · CPC title

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K1/0213 Primary

  Electrical arrangements not otherwise provided for · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title