Embedded package substrate capacitor with configurable/controllable equivalent series resistance

Patent metadata

Field	Value
Publication number	US-9449762-B2
Application number	US-201414272356-A
Country	US
Kind code	B2
Filing date	May 7, 2014
Priority date	May 7, 2014
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

Some novel features pertain to package substrates that include a substrate having an embedded package substrate (EPS) capacitor with equivalent series resistance (ESR) control. The EPS capacitor includes two conductive electrodes separated by a dielectric or insulative thin film material and an equivalent series resistance (ESR) control structure located on top of each electrode connecting the electrodes to vias. The ESR control structure may include a metal layer, a dielectric layer, and a set of metal pillars which are embedded in the set of metal pillars are embedded in the dielectric layer and extend between the electrode and the metal layer. The EPS capacitor having the ESR control structure form an ESR configurable EPS capacitor which can be embedded in package substrates.

First claim

What is claimed is:

1. A capacitor structure, comprising:
a first electrode comprising a first surface and an opposing second surface;
a second electrode comprising a third surface and an opposing fourth surface;
a first dielectric layer coupled to and separating the first and second electrodes; and
a first equivalent series resistance (ESR) control structure, comprising a first ESR value, coupled to the first electrode, the first ESR control structure comprising:
a second dielectric layer coupled to the first surface of the first electrode;
a first metal layer coupled to a first surface of the second dielectric layer; and
a first set of pillars embedded in the second dielectric layer and extending between the first electrode and the first metal layer;

further comprising a second ESR control structure, comprising a second ESR value different from the first ESR value, coupled to the first electrode, the second ESR control structure comprising:
a third dielectric layer coupled to the second surface of the first electrode;
a second metal layer coupled to a first surface of the third dielectric layer; and
a second set of pillars embedded in the third dielectric layer and extending between the first electrode and the second metal layer.

2. The capacitor structure of claim 1 , wherein the first surface of the first electrode is an upper surface and the second surface of the first electrode is a lower surface.

3. The capacitor structure of claim 1 , wherein a total number of pillars in the first set of pillars is the same as a total number of pillars in the second set of pillars.

4. The capacitor structure of claim 1 , wherein a total number of pillars in the first set of pillars is different than a total number of pillars in the second set of pillars.

5. A capacitor structure, comprising:
a first electrode comprising a first surface and an opposing second surface;
a second electrode comprising a third surface and an opposing fourth surface;
a first dielectric layer coupled to and separating the first and second electrodes; and
a first equivalent series resistance (ESR) control structure coupled to the first electrode, the first ESR control structure comprising:
a second dielectric layer coupled to the first surface of the first electrode;
a first metal layer coupled to a first surface of the second dielectric layer; and
a first set of pillars embedded in the second dielectric layer and extending between the first electrode and the first metal layer,

further comprising a second ESR control structure coupled to the second electrode, the second ESR control structure comprising:
a third dielectric layer coupled to the third surface of the second electrode;
a second metal layer coupled to a first surface of the third dielectric layer; and
a second set of pillars embedded in the third dielectric layer and extending between the second electrode and the second metal layer.

6. A capacitor structure, comprising:
a first electrode comprising a first surface and an opposing second surface;
a second electrode comprising a third surface and an opposing fourth surface;
a first dielectric layer coupled to and separating the first and second electrodes; and
a first equivalent series resistance (ESR) control structure coupled to the first electrode, the first ESR control structure comprising:
a second dielectric layer coupled to the first surface of the first electrode;
a first metal layer coupled to a first surface of the second dielectric layer; and
a first set of pillars embedded in the second dielectric layer and extending between the first electrode and the first metal layer;

a second ESR control structure coupled to the first electrode, the second ESR control structure comprising:
a third dielectric layer coupled to the second surface of the first electrode;
a second metal layer coupled to a first surface of the third dielectric layer; and
a second set of pillars embedded in the third dielectric layer and extending between the first electrode and the second metal layer.

7. The capacitor structure of claim 6 , wherein a total number of pillars in the first set of pillars is the same as a total number of pillars in the second set of pillars.

8. The capacitor structure of claim 6 , wherein a total number of pillars in the first set of pillars is the different than a total number of pillars in the second set of pillars.

9. The capacitor structure of claim 8 , wherein a number of pillars in the first set of pillars is selected based on a desired (ESR) value.

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Hwang Kyu-Pyung
• Kim Dong Wook
• Zhang Xiaonan
• Lane Ryan David

Classifications

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title