Method of assembling a capacitor assembly

US9761375B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9761375-B2
Application numberUS-201414278581-A
CountryUS
Kind codeB2
Filing dateMay 15, 2014
Priority dateNov 30, 2010
Publication dateSep 12, 2017
Grant dateSep 12, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of assembling a capacitor assembly comprises positioning a plurality of capacitors in respective sockets formed in a non-conductive matrix by vibrating the plurality of capacitors and disposing the array of capacitors and the non-conductive matrix between a positive terminal plate and a negative terminal plate. The capacitors are electrically coupled with the positive terminal plate and the negative terminal plate and mechanically secured between the positive terminal plate and the negative terminal plate. The array of capacitors includes a void cooperating with a first opening in the positive plate and a second opening in the negative plate to form a passage. The void includes a location where at least one capacitor is omitted from the array.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of assembling a capacitor assembly, the method comprising: positioning a plurality of capacitors in respective sockets formed in a non-conductive matrix by vibrating the plurality of capacitors, to form an array of capacitors; disposing the array of capacitors and the non-conductive matrix between a positive terminal plate and a negative terminal plate, the array of capacitors including a void cooperating with a first opening in the positive plate and a second opening in the negative plate to form a passage, the void including a location where at least one capacitor is omitted from the array; electrically coupling the capacitors with the positive terminal plate and the negative terminal plate; and mechanically securing the capacitors between the positive terminal plate and the negative terminal plate. 2. The method as defined in claim 1 , wherein the void is surrounded by capacitors within the array of capacitors. 3. The method as defined in claim 1 , comprising applying an electrically conductive epoxy to electrically couple the capacitors to the positive terminal plate and the negative terminal plate.

Assignees

Inventors

Classifications

  • Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

  • Electric condenser making · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

  • leading through the housing, i.e. lead-through · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9761375B2 cover?
A method of assembling a capacitor assembly comprises positioning a plurality of capacitors in respective sockets formed in a non-conductive matrix by vibrating the plurality of capacitors and disposing the array of capacitors and the non-conductive matrix between a positive terminal plate and a negative terminal plate. The capacitors are electrically coupled with the positive terminal plate an…
Who is the assignee on this patent?
Pratt & Whitney Canada
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).