Multilayer ceramic electronic component and mounting structure thereof
US-2018374642-A1 · Dec 27, 2018 · US
Mountings
Mountings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G2/02 |
| Official title | Mountings |
| Display label | Mountings |
| Total patents | 472 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 20 |
| 2017 | 19 |
| 2018 | 31 |
| 2019 | 19 |
| 2020 | 40 |
| 2021 | 59 |
| 2022 | 83 |
| 2023 | 67 |
| 2024 | 60 |
| 2025 | 36 |
| 2026 | 22 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitor and method to manufacture the capacitor
US-10092766-B2 · Oct 9, 2018 · US
Low impedance oxide resistant grounded capacitor for an AIMD
US-9931514-B2 · Apr 3, 2018 · US
Gold wetting on ceramic surfaces upon coating with titanium hydride
US-2018085591-A1 · Mar 29, 2018 · US
Electrical component comprising a connection element having a plastic body
US-9865394-B2 · Jan 9, 2018 · US
Electronic device, piezoelectric device, liquid ejecting head, and manufacturing methods for electronic device, piezoelectric device, and liquid ejecting head
US-9840077-B2 · Dec 12, 2017 · US
Capacitor element-mounted structure
US-2017339792-A1 · Nov 23, 2017 · US
Isolating device for electrically isolating a plurality of power-storage assemblies from one another
US-9818988-B2 · Nov 14, 2017 · US
Energy storage device, method of manufacturing same, and mobile electronic device containing same
US-9793061-B2 · Oct 17, 2017 · US
Electronic device, piezoelectric device, liquid ejecting head, and manufactruing methods for electronic device, piezoelectric device, and liquid ejecting head
US-2017266970-A1 · Sep 21, 2017 · US
Method of mounting passive electronic component on lead frame
US-9721877-B1 · Aug 1, 2017 · US
Power reception device, power transmission device, and power transfer system
US-9711282-B2 · Jul 18, 2017 · US
Device for supporting a power storage assembly
US-9706671-B2 · Jul 11, 2017 · US
Electronic device, piezoelectric device, liquid ejecting head, and manufacturing methods for electronic device, piezoelectric device, and liquid ejecting head
US-9694580-B2 · Jul 4, 2017 · US
Wiring module
US-2017141375-A1 · May 18, 2017 · US
Capacitor for saw filter, saw filter and method of manufacturing thereof
US-9654084-B2 · May 16, 2017 · US
Multilayer electronic component and board having the same
US-2017127520-A1 · May 4, 2017 · US
Passive-on-glass (pog) device and method
US-2017077079-A1 · Mar 16, 2017 · US
Electronic device, piezoelectric device, liquid ejecting head, and manufactruing methods for electronic device, piezoelectric device, and liquid ejecting head
US-2017057230-A1 · Mar 2, 2017 · US
Power electronic subassembly with capacitor
US-2017055366-A1 · Feb 23, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01G2/02?
- CPC H01G2/02 is the Cooperative Patent Classification code for “Mountings.”
- How many patents are filed under CPC H01G2/02 (Mountings)?
- Our database includes 472 publications tagged with this CPC code.
- Is patent activity under CPC H01G2/02 growing?
- Publication counts under this code: 60 in 2024 vs 36 in 2025 (latest complete years).