Electrical component comprising a connection element having a plastic body

US9865394B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9865394-B2
Application numberUS-201314415548-A
CountryUS
Kind codeB2
Filing dateJun 19, 2013
Priority dateJul 17, 2012
Publication dateJan 9, 2018
Grant dateJan 9, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A component comprising: a component body; at least one connection element having a plastic body, wherein the plastic body comprises polyester ether ketone, the plastic body comprising: a first part arranged adjacently to the component body; and a second part extending at an angle from the first part, wherein the angle between the first and the second part is substantially 90°; a metallization arranged at least in regions of an outer side on the first part and at least in regions of an outer side of the second part of the plastic body; a metal layer arranged on the first part and the metallization, wherein the metal layer comprises sintered silver and has a strip-shaped geometry with a width-to-thickness ratio greater than 6, wherein the metal layer is disposed between the metallization of the plastic body and a first layer that is one of a sputtered layer disposed on the component body or a baked-on layer disposed on the component body, wherein the metal layer is connected, by soldering, to the first layer, wherein the at least one connection element is connected to the component body via the metal layer, and wherein a form and a size of the metal layer corresponds substantially to a form and a size of a side of the component body to be contacted; and an electrically conductive connection surface arranged on the second part and the metallization, wherein the metal layer and the connection surface are separate and independent and electrically connected. 2. The component according to claim 1 , wherein the connection surface comprises a nickel gold palladium coating. 3. The component according to claim 1 , wherein the metal layer has the strip-shaped geometry with the width-to-thickness ratio greater than 30. 4. The component according to claim 1 , wherein the component body comprises a capacitor body with a stack of ceramic dielectric layers and inner electrodes. 5. The component according to claim 4 , wherein the ceramic dielectric layers comprise an anti-ferroelectric perovskite. 6. The component according to claim 1 , wherein the component body is cuboidal with two angled connection elements on opposite sides of the component body. 7. A component comprising: a component body; at least one connection element having a plastic body, the plastic body comprising: a first part arranged adjacently to the component body; and a second part extending at an angle from the first part, wherein the angle between the first and the second part is substantially 90°; a metallization arranged at least in regions of an outer side on the first part and at least in regions of an outer side on the second part of the plastic body; a metal layer arranged on the first part and the metallization, wherein the metal layer consists essentially of sintered silver and has a strip-shaped geometry with a width-to-thickness ratio greater than 6, wherein the metal layer is disposed between the metallization of the plastic body and a first layer that is one of a sputtered layer disposed on the component body or a baked-on layer disposed on the component body, wherein the metal layer is connected, by soldering, to the first layer, wherein the at least one connection element is connected to the component body via the metal layer, and wherein a form and a size of the metal layer corresponds substantially to a side of the component body to be contacted; and an electrically conductive connection surface arranged on the second part and the metallization, wherein the metal layer and the connection surface are separate and independent and electrically connected. 8. The component according to claim 7 , wherein the connection surface comprises a nickel gold palladium coating. 9. The component according to claim 7 , wherein the plastic body comprises a material selected from the group consisting of polyester ether ketone and polyimide. 10. The component according to claim 7 , wherein the metal layer has the strip-shaped geometry with the width-to-thickness ratio greater than 30. 11. The component according to claim 7 , wherein the component body comprises a capacitor body with a stack of ceramic dielectric layers and inner electrodes. 12. The component according to claim 11 , wherein the ceramic dielectric layers comprise an anti-ferroelectric perovskite. 13. The component according to claim 7 , wherein the component body is cuboidal with two angled connection elements on opposite sides of the component body.

Assignees

Inventors

Classifications

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G4/228Primary

    Terminals · CPC title

  • Electrodes · CPC title

  • characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

  • based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9865394B2 cover?
An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.
Who is the assignee on this patent?
Epcos Ag
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).