Capacitor and method for manufacturing same
US-2024347278-A1 · Oct 17, 2024 · US
US9865394B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9865394-B2 |
| Application number | US-201314415548-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 19, 2013 |
| Priority date | Jul 17, 2012 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electrical component is disclosed. In an embodiment the component includes a component body and at least one connection element having a plastic body, wherein the at least one connection element is connected to the component body via a metal layer.
Opening claim text (preview).
The invention claimed is: 1. A component comprising: a component body; at least one connection element having a plastic body, wherein the plastic body comprises polyester ether ketone, the plastic body comprising: a first part arranged adjacently to the component body; and a second part extending at an angle from the first part, wherein the angle between the first and the second part is substantially 90°; a metallization arranged at least in regions of an outer side on the first part and at least in regions of an outer side of the second part of the plastic body; a metal layer arranged on the first part and the metallization, wherein the metal layer comprises sintered silver and has a strip-shaped geometry with a width-to-thickness ratio greater than 6, wherein the metal layer is disposed between the metallization of the plastic body and a first layer that is one of a sputtered layer disposed on the component body or a baked-on layer disposed on the component body, wherein the metal layer is connected, by soldering, to the first layer, wherein the at least one connection element is connected to the component body via the metal layer, and wherein a form and a size of the metal layer corresponds substantially to a form and a size of a side of the component body to be contacted; and an electrically conductive connection surface arranged on the second part and the metallization, wherein the metal layer and the connection surface are separate and independent and electrically connected. 2. The component according to claim 1 , wherein the connection surface comprises a nickel gold palladium coating. 3. The component according to claim 1 , wherein the metal layer has the strip-shaped geometry with the width-to-thickness ratio greater than 30. 4. The component according to claim 1 , wherein the component body comprises a capacitor body with a stack of ceramic dielectric layers and inner electrodes. 5. The component according to claim 4 , wherein the ceramic dielectric layers comprise an anti-ferroelectric perovskite. 6. The component according to claim 1 , wherein the component body is cuboidal with two angled connection elements on opposite sides of the component body. 7. A component comprising: a component body; at least one connection element having a plastic body, the plastic body comprising: a first part arranged adjacently to the component body; and a second part extending at an angle from the first part, wherein the angle between the first and the second part is substantially 90°; a metallization arranged at least in regions of an outer side on the first part and at least in regions of an outer side on the second part of the plastic body; a metal layer arranged on the first part and the metallization, wherein the metal layer consists essentially of sintered silver and has a strip-shaped geometry with a width-to-thickness ratio greater than 6, wherein the metal layer is disposed between the metallization of the plastic body and a first layer that is one of a sputtered layer disposed on the component body or a baked-on layer disposed on the component body, wherein the metal layer is connected, by soldering, to the first layer, wherein the at least one connection element is connected to the component body via the metal layer, and wherein a form and a size of the metal layer corresponds substantially to a side of the component body to be contacted; and an electrically conductive connection surface arranged on the second part and the metallization, wherein the metal layer and the connection surface are separate and independent and electrically connected. 8. The component according to claim 7 , wherein the connection surface comprises a nickel gold palladium coating. 9. The component according to claim 7 , wherein the plastic body comprises a material selected from the group consisting of polyester ether ketone and polyimide. 10. The component according to claim 7 , wherein the metal layer has the strip-shaped geometry with the width-to-thickness ratio greater than 30. 11. The component according to claim 7 , wherein the component body comprises a capacitor body with a stack of ceramic dielectric layers and inner electrodes. 12. The component according to claim 11 , wherein the ceramic dielectric layers comprise an anti-ferroelectric perovskite. 13. The component according to claim 7 , wherein the component body is cuboidal with two angled connection elements on opposite sides of the component body.
Stacked capacitors (H01G4/33 takes precedence) · CPC title
Terminals · CPC title
Electrodes · CPC title
characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title
based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.