Electronic device, piezoelectric device, liquid ejecting head, and manufacturing methods for electronic device, piezoelectric device, and liquid ejecting head

Patent metadata

Field	Value
Publication number	US-9694580-B2
Application number	US-201615240864-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Aug 25, 2015
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An electronic device includes a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein. At least one end of the capacitor is defined by an end of the second electrode layer. The insulating layer is provided so as to extend to a non-element region that is on the outside of one end of the capacitor. The insulating layer under the non-element region is formed thinner than the insulating layer under the capacitor. A difference between the thickness of the insulating layer under the non-element region and the thickness of the insulating layer under the capacitor is equal to or less than 50 nm.

First claim

What is claimed is:

1. An electronic device comprising:
a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein,
wherein at least one end of the capacitor is defined by an end of the second electrode layer,
wherein the insulating layer is provided so as to extend to a non-element region that is on outside of one end of the capacitor,
wherein the insulating layer under the non-element region is formed thinner than the insulating layer under the capacitor, and
wherein a difference between the thickness of the insulating layer under the non-element region and the thickness of the insulating layer under the capacitor is equal to or less than 50 nm.

2. A piezoelectric device,
wherein, in the electronic device according to claim 1 , the insulating layer is a piezoelectric layer, and the capacitor is a piezoelectric element.

3. A liquid ejecting head comprising:
the piezoelectric device according to claim 2 ;
a pressure chamber of which a volume is changed, following deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

4. A manufacturing method for an electronic device including a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein, the manufacturing method for an electronic device comprising:
etching the second electrode layer to remove the second electrode layer and continuously etching the insulating layer in a non-element region that is on the outside of at least one end of the capacitor defined by an end of the second electrode layer generated by the etching of the second electrode layer even after the removal of the second electrode layer, such that the insulating layer under the non-element region is removed by 50 nm or less in a thickness direction.

5. A manufacturing method for a piezoelectric device,
wherein, in the manufacturing method for an electronic device according to claim 4 , the insulating layer is a piezoelectric layer, and the capacitor is a piezoelectric element.

6. A manufacturing method for a liquid ejecting head comprising:
the manufacturing method for a piezoelectric device according to claim 5 ;
forming a pressure chamber of which a volume is changed, following deformation of the piezoelectric element; and
forming a nozzle plate where a nozzle that communicates with the pressure chamber is formed.

Assignees

• Seiko Epson Corp

Inventors

• Asaoka Ichiro
• Morozumi Koichi
• Shimada Masato
• Kuriki Akira

Classifications

• B41J2/1628

  dry etching · CPC title

• B41J2/161

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/1631

  photolithography · CPC title

• B41J2/14233

  of film type, deformed by bending and disposed on a diaphragm · CPC title