Electronic device, piezoelectric device, liquid ejecting head, and manufacturing methods for electronic device, piezoelectric device, and liquid ejecting head

Patent metadata

Field	Value
Publication number	US-9840077-B2
Application number	US-201715614889-A
Country	US
Kind code	B2
Filing date	Jun 6, 2017
Priority date	Aug 25, 2015
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

An electronic device includes a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein. At least one end of the capacitor is defined by an end of the second electrode layer. The insulating layer is provided so as to extend to a non-element region that is on the outside of one end of the capacitor. The insulating layer under the non-element region is formed thinner than the insulating layer under the capacitor. A difference between the thickness of the insulating layer under the non-element region and the thickness of the insulating layer under the capacitor is equal to or less than 50 nm.

First claim

What is claimed is:

1. A piezoelectric device comprising:
a diaphragm; and
a plurality of piezoelectric elements,
wherein each one of the plurality of piezoelectric elements is configured with a first electrode layer, a first piezoelectric layer, and a second electrode layer being stacked on the diaphragm in the order listed herein,
wherein the piezoelectric element is defined by a region where the first electrode, the piezoelectric layer and the second electrode layer are stacked,
wherein the piezoelectric layer is provided so as to extend to a non-element region that is outside of the piezoelectric element,
wherein the piezoelectric layer of the non-element region is formed thinner than the piezoelectric layer of the piezoelectric element in a direction intersectional to a direction which the plurality of piezoelectric elements are arranged,
wherein a damaged layer is formed on a surface of the piezoelectric layer of the non-element region, and
wherein a thickness of the damaged layer is equal to or less than 30 nm.

2. The piezoelectric device according to claim 1 , wherein the damaged layer is amorphous.

3. The piezoelectric device according to claim 1 , wherein, in the direction intersectional to the direction which the plurality of piezoelectric elements are arranged, a boundary of the piezoelectric layer of the non-element region, which is on the piezoelectric element side, is in a state of being sloped from the piezoelectric element.

4. A liquid ejecting head comprising:
the piezoelectric device according to claim 1 ;
a pressure chamber of which a volume is changed, following deformation of the piezoelectric element; and
a nozzle that communicates with the pressure chamber.

5. A manufacturing method for a piezoelectric device including a diaphragm, and a plurality of piezoelectric elements, wherein each one of the plurality of piezoelectric elements is configured with a first electrode layer, a piezoelectric layer, and a second electrode layer being stacked on the diaphragm in the order listed herein, the manufacturing method for the piezoelectric device comprising:
etching the second electrode layer to remove the second electrode layer and, in a direction intersectional to a direction which the plurality of piezoelectric elements are arranged, continuously etching the piezoelectric layer in a non-element region that is outside of a piezoelectric element defined by a region where the first electrode, the piezoelectric layer and the second electrode layer are stacked, such that a damaged layer of which a thickness is equal to or less than 30 nm is formed on a surface of the piezoelectric layer of the non-element region.

6. The manufacturing method for the piezoelectric device according to claim 5 , wherein the damaged layer is amorphous.

7. The manufacturing method for the piezoelectric device according to claim 5 , wherein, in a direction intersectional to a direction which the plurality of piezoelectric elements are arranged, a slope from the piezoelectric element is formed in a boundary of the piezoelectric layer of the non-element region, which is on the piezoelectric element side, by the etching.

8. A manufacturing method for a liquid ejecting head comprising:
the manufacturing method for the piezoelectric device according to claim 5 ;
forming a pressure chamber of which a volume is changed, following deformation of the piezoelectric element; and
forming a nozzle plate where a nozzle that communicates with the pressure chamber is formed.

Assignees

• Seiko Epson Corp

Inventors

• Asaoka Ichiro
• Morozumi Koichi
• Shimada Masato
• Kuriki Akira

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/228

  Terminals · CPC title

• H01G2/02

  Mountings · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• B41J2/14201 Primary

  Structure of print heads with piezoelectric elements · CPC title