Multilayer electronic component and method of manufacturing the same
US-11996244-B2 · May 28, 2024 · US
with provision for removing metal surfaces · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G13/06 |
| Official title | with provision for removing metal surfaces |
| Display label | with provision for removing metal surfaces |
| Total patents | 20 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2017 | 1 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 3 |
| 2022 | 5 |
| 2023 | 3 |
| 2024 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11996244-B2 · May 28, 2024 · US
US-11858816-B2 · Jan 2, 2024 · US
US-11757168-B2 · Sep 12, 2023 · US
US-11600445-B2 · Mar 7, 2023 · US
US-2023053249-A1 · Feb 16, 2023 · US
US-2022384114-A1 · Dec 1, 2022 · US
US-11469047-B2 · Oct 11, 2022 · US
US-11427474-B2 · Aug 30, 2022 · US
US-11332841-B2 · May 17, 2022 · US
US-2022037757-A1 · Feb 3, 2022 · US
US-2021280372-A1 · Sep 9, 2021 · US
US-2021163297-A1 · Jun 3, 2021 · US
US-2021090811-A1 · Mar 25, 2021 · US
US-10685786-B2 · Jun 16, 2020 · US
US-2020013555-A1 · Jan 9, 2020 · US
US-2019304703-A1 · Oct 3, 2019 · US
US-9779874-B2 · Oct 3, 2017 · US
US-2015360952-A1 · Dec 17, 2015 · US
US-9082548-B2 · Jul 14, 2015 · US
US-2015131204-A1 · May 14, 2015 · US