Multilayer electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11996244-B2
Application number	US-202217723919-A
Country	US
Kind code	B2
Filing date	Apr 19, 2022
Priority date	May 25, 2021
Publication date	May 28, 2024
Grant date	May 28, 2024

Abstract

A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and
external electrodes disposed on the body,
wherein:
when a region in which the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion,
in a cross-section of the body in the first and second directions, (F 1 +F 2 )/D 1 ×100 is 35 or less, where F 1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F 2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D 1 is a size of the capacitance forming portion in the first direction at a center thereof in the second direction, and
the external electrodes include first and second external electrodes disposed on the third and fourth surfaces, respectively, and the plurality of internal electrodes includes the first internal electrodes connected to the first external electrode at the third surface, and second internal electrodes connected to the second external electrode at the fourth surface.

2. The multilayer electronic component of claim 1 , wherein (D 2 /D 1 )×100 is 96.5 or more, where D 1 is the size of the capacitance forming portion in the first direction at the center thereof in the second direction, and D 2 is a size of the capacitance forming portion in the first direction at an end thereof in the second direction.

3. The multilayer electronic component of claim 2 , wherein the first internal electrodes are spaced apart from the fourth surface of the body, and the second internal electrodes are spaced apart from the third surface of the body, and
(D 3 /D 1 )×100 is 90 or more, where D 3 is a size from an uppermost first internal electrode to a lowermost first internal electrode in the first direction on the third surface of the body.

4. The multilayer electronic component of claim 1 , wherein [(G 1 +G 2 )/D 1 ]×100 is 2.4 or less, where G 1 is a distance from an extension line of the uppermost internal electrode to an end of an internal electrode closest to the uppermost internal electrode in the first direction, and G 2 is a distance from an extension line of the lowermost internal electrode to an end of an internal electrode closest to the lowermost internal electrode in the first direction.

5. The multilayer electronic component of claim 1 , wherein in the internal electrodes that are curved at end portions thereof in the capacitance forming portion, the end portions are curved toward the center of the capacitance forming portion in the first direction.

6. The multilayer electronic component of claim 1 , wherein internal electrodes having end portions curved downward in the first direction are disposed in an upper portion of the capacitance forming portion in the first direction, internal electrodes having end portions curved upward in the first direction are disposed in a lower portion of the capacitance forming portion in the first direction, and flat internal electrodes are disposed at a central portion of the capacitance forming portion in the first direction.

7. The multilayer electronic component of claim 1 , wherein each of the internal electrodes has an internal electrode connectivity of 80% or more, the internal electrode connectivity being a ratio of a length of a portion where the internal electrode is actually present to an overall length of the internal electrode.

8. The multilayer electronic component of claim 1 , wherein each of the internal electrodes has an average thickness of 0.4 μm or less.

9. The multilayer electronic component of claim 1 , wherein each of the dielectric layers has an average thickness of 0.45 μm or less.

10. The multilayer electronic component of claim 1 , further comprising cover portions disposed on both end surfaces of the capacitance forming portion in the first direction, respectively.

11. The multilayer electronic component of claim 10 , wherein each of the cover portions has an average thickness of 15 μm or less.

12. The multilayer electronic component of claim 1 , wherein a maximum size of the multilayer electronic component in the second direction is 0.66 mm or less, and a maximum size of the multilayer electronic component in the third direction is 0.33 mm or less.

13. A multilayer electronic component comprising:
a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and
external electrodes disposed on the body,
wherein when a region in which the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and
in a cross-section of the body in the first and second directions, (F 1 +F 2 )/D 1 ×100 is 35 or less, where F 1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F 2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D 1 is a size of the capacitance forming portion in the first direction at a center thereof in the second direction, and
(D 2 /D 1 )×100 is 96.5 or more, where D 1 is the size of the capacitance forming portion in the first direction at the center thereof in the second direction, and D 2 is a size of the capacitance forming portion in the first direction at both ends thereof in the second direction.

14. The multilayer electronic component of claim 13 , wherein the first internal electrodes are spaced apart from the fourth surface of the body, and the second internal electrodes are spaced apart from the third surface of the body, and
(D 3 /D 1 )×100 is 90 or more, where D 3 is a size from an uppermost first internal electrode to a lowermost first internal electrode in the first direction on the third surface of the body.

15. The multilayer electronic component of claim 13 , wherein [(G 1 +G 2 )/D 1 ]×100 is 2.4 or less, where G 1 is a distance from an extension line of the uppermost internal electrode to an end of an internal electrode closest to the uppermost internal electrode in the first direction, and G 2 is a distance from an extension line of the lowermost internal electrode to an end of an internal electrode closest to the lowermost internal electrode in the first direction.

16. The mu

Assignees

• Samsung Electro Mech

Inventors

• Mun Seon Jae
• Kim Gi Long
• Cha Kyoung Jin
• Lee Tae Gyeom
• Ahn Byung Rok
• Lee Jong Ho

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G13/06

  with provision for removing metal surfaces · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title