Method for manufacturing a multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11600445-B2
Application number	US-202017016687-A
Country	US
Kind code	B2
Filing date	Sep 10, 2020
Priority date	Sep 19, 2019
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.

First claim

What is claimed is:

1. A method for manufacturing a multilayer ceramic electronic component, the method comprising:
preparing a plurality of the multilayer bodies each including a plurality of stacked ceramic layers and including a first major surface and a second major surface opposite to each other in a layer stacking direction, a first side surface and a second side surface opposite to each other in a widthwise direction substantially orthogonal to the layer stacking direction, and a first end surface and a second end surface opposite to each other in a lengthwise direction substantially orthogonal to the layer stacking direction and the widthwise direction;
stacking the plurality of multilayer bodies by adhering a binder between respective major surfaces of at least two of the plurality of the multilayer bodies;
rotating the stacked plurality of multilayer bodies concurrently by about 90° with the lengthwise direction defining and functioning as an axis of rotation;
providing a side gap portion on at least a portion of the first side surface or the second side surface of the plurality of multilayer bodies; and
removing the binder from the plurality of multilayer bodies after being provided with the side gap portion to provide the multilayer ceramic electronic component; wherein
the multilayer ceramic electronic component includes a length of a dimension T in the layer stacking direction and a length of a dimension W in the widthwise direction; and
the dimension T is smaller than the dimension W.

2. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein the dimension T of the multilayer ceramic electronic component is not less than 0.08 mm and not more than 0.15 mm, and the dimension W of the multilayer ceramic electronic component is not less than twice the dimension T.

3. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein
the binder is a water-soluble film; and
the removing the binder includes dissolving the water-soluble film with water.

4. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein the preparing the plurality of multilayer bodies includes screen-printing an external electrode on at least one of the first and second major surfaces of the multilayer bodies.

5. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , further comprising forming an end surface electrode by a dipping method after the step of removing the binder.

6. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein each of the multilayer bodies has a substantially rectangular parallelepiped shape.

7. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein
the preparing the plurality of the multilayer bodies includes forming a first internal electrode layer and a forming second internal electrode layer; and
at least one of the plurality of stacked ceramic layers is provided between the first internal electrode layer and the second internal electrode layer in a stacking direction of the plurality of stacked ceramic layers.

8. The method for manufacturing a multilayer ceramic electronic component according to claim 7 , wherein
the first internal electrode layer includes a first opposite electrode portion and a first lead electrode portion;
the second internal electrode layer includes a second opposite electrode portion and a second lead electrode portion; and
the first opposite electrode portion and the second opposite electrode portion face one another.

9. The method for manufacturing a multilayer ceramic electronic component according to claim 8 , further comprising:
forming a first external electrode on the first end surface and forming a second external electrode on the second end surface; wherein
the first lead electrode portion is electrically connected to the first external electrode; and
the second lead electrode portion is electrically connected to the second external electrode.

10. The method for manufacturing a multilayer ceramic electronic component according to claim 7 , further comprising:
forming a first external electrode on the first end surface and forming a second external electrode on the second end surface; wherein
the forming the first internal electrode layer includes forming a plurality of first internal electrode layers, and the forming the second internal electrode layer includes forming a plurality of second internal electrode layers.

11. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein at least one of the plurality of stacked ceramic layers includes a dielectric material.

12. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein the providing the side gap portion includes providing a first side gap portion that covers at least a portion of the first side surface and providing a second side gap portion that covers at least a portion of the second side surface.

13. The method for manufacturing a multilayer ceramic electronic component according to claim 12 , wherein the first side gap portion substantially entirely covers the first side surface and the second side gap portion substantially entirely covers the second side surface.

14. The method for manufacturing a multilayer ceramic electronic component according to claim 12 , further comprising:
forming a first external electrode on the first end surface and forming a second external electrode on the second end surface; wherein
the first external electrode at least partially covers the first side gap, and the second external electrode at least partially covers the second side gap.

15. The method for manufacturing a multilayer ceramic electronic component according to claim 1 , wherein the side gap portion is provided by pressing a sheeting including a resin and a rubber material against the plurality of multilayer bodies.

Assignees

• Murata Manufacturing Co

Inventors

• Yokota Yusuke
• Matsui Togo

Classifications

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G13/006

  Apparatus or processes for applying terminals · CPC title