Polishing Pad Assembly for Electrochemical Mechanical Polishing
US-2025353136-A1 · Nov 20, 2025 · US
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of semiconducting materials
of semiconducting materials · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25F3/30 |
| Official title | of semiconducting materials |
| Display label | of semiconducting materials |
| Total patents | 23 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 4 |
| 2017 | 2 |
| 2018 | 2 |
| 2019 | 1 |
| 2020 | 1 |
| 2021 | 1 |
| 2022 | 1 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Face-up wafer electrochemical planarization apparatus
US-2025001547-A1 · Jan 2, 2025 · US
Face-up wafer electrochemical planarization apparatus
US-12090600-B2 · Sep 17, 2024 · US
Polishing Device for Indium Phosphide Substrate, and Polishing Process
US-2024035192-A1 · Feb 1, 2024 · US
Face-up wafer electrochemical planarization apparatus
US-2023390887-A1 · Dec 7, 2023 · US
Method for planarizing cis-based thin film, cis-based thin film manufactured using the same, and solar cell comprising cis-based thin film
US-2023290899-A1 · Sep 14, 2023 · US
Controlled induced warping of electronic substrates via electroplating
US-11236436-B2 · Feb 1, 2022 · US
Controlled Induced Warping of Electronic Substrates via Electroplating
US-2021230765-A1 · Jul 29, 2021 · US
Dishing reducing in tungsten chemical mechanical polishing
US-10570313-B2 · Feb 25, 2020 · US
Apparatus and method for plating and/or polishing wafer
US-10227705-B2 · Mar 12, 2019 · US
Electrochemical deposition chamber
US-9903039-B2 · Feb 27, 2018 · US
Method and apparatus for pulse electrochemical polishing
US-9865476-B2 · Jan 9, 2018 · US
Nozzle for stress-free polishing metal layers on semiconductor wafers
US-9724803-B2 · Aug 8, 2017 · US
Electrochemical polishing solution, process for electrochemically polishing graphite gate electrode and graphite gate electrode
US-9551085-B2 · Jan 24, 2017 · US
Dishing reducing in tungsten chemical mechanical polishing
US-2016237315-A1 · Aug 18, 2016 · US
Apparatus and method for plating and/or polishing wafer
US-2016115613-A1 · Apr 28, 2016 · US
Method and apparatus for electroplating
US-9309604-B2 · Apr 12, 2016 · US
Electro-polishing and porosification
US-9249523-B2 · Feb 2, 2016 · US
Enhanced porosification
US-9217206-B2 · Dec 22, 2015 · US
Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US-9214359-B2 · Dec 15, 2015 · US