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Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
US9214359B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214359-B2 |
| Application number | US-201414281606-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2014 |
| Priority date | Aug 30, 2000 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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Abstract
Official abstract text for this publication.
A method and apparatus for simultaneously removing conductive materials from a microelectronic substrate. A method in accordance with one embodiment of the invention includes contacting a surface of a microelectronic substrate with an electrolytic liquid, the microelectronic substrate having first and second different conductive materials. The method can further include controlling a difference between a first open circuit potential of the first conducive material and a second open circuit potential of the second conductive material by selecting a pH of the electrolytic liquid. The method can further include simultaneously removing at least portions of the first and second conductive materials by passing a varying electrical signal through the electrolytic liquid and the conductive materials. Accordingly, the effects of galvanic interactions between the two conductive materials can be reduced and/or eliminated.
First claim
Opening claim text (preview).
I claim: 1. A method for processing a microelectronic substrate, the method comprising: selecting a pH based at least partially on an absolute value of a difference between a first open circuit potential of a second conductive material at the pH and a second open circuit potential of a second conductive material at the pH, wherein the second conductive material is different than the first conductive material; contacting a surface of a microelectronic substrate with an electrolyt…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P50/00Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9214359B2 cover?
- A method and apparatus for simultaneously removing conductive materials from a microelectronic substrate. A method in accordance with one embodiment of the invention includes contacting a surface of a microelectronic substrate with an electrolytic liquid, the microelectronic substrate having first and second different conductive materials. The method can further include controlling a difference…
- Who is the assignee on this patent?
- Micron Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P50/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).