Electrochemical deposition chamber

Patent metadata

Field	Value
Publication number	US-9903039-B2
Application number	US-201414218051-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Mar 18, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

According to the invention an electrochemical deposition or polishing clamber including:
a support for a substrate, the support having an in-use position; a housing having an interior surface and a fluid outlet pathway for removing an electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface; a seal for sealing the housing to a peripheral portion of a surface of a substrate position on the support in its in-use position; and a tilting mechanism for tilting the chamber in order to assist in removing electrolyte from the housing through the fluid outlet pathway.

First claim

The invention claimed is:

1. An electrochemical deposition or polishing chamber including:
a support for a substrate, the support having an in-use position;
a housing having an interior surface and a fluid outlet pathway for removing an electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface, the interior surface includes an overhanging section, the slotted opening is formed in the overhanging section, and the slotted opening is formed so as to face downwardly into the chamber;
a seal for sealing the housing to a peripheral portion of a surface of a substrate positioned on the support in its in-use position;
a tilting mechanism for tilting the chamber by less than 10° in order to assist in removing electrolyte from the housing through the fluid outlet pathway; and
an electrode disposed within the chamber and an electrode contact for contacting the substrate when the support is in its in-use position, in which, when the support is in its in-use position, the separation between the substrate and the electrode is less than 40 mm.

2. An electrochemical deposition or polishing chamber according to claim 1 in which the fluid outlet pathway includes a slot which is in communication with a slotted opening and extends generally upwardly therefrom.

3. An electrochemical deposition or polishing chamber according to claim 1 in which the housing includes a lower housing portion and an upper housing portion which are spaced apart to define at least one slot and, optionally, at least one slotted opening.

4. An electrochemical deposition or polishing chamber according to claim 3 in which the upper housing portion is a shroud member which is positioned over the lower housing portion.

5. An electrochemical deposition or polishing chamber according to claim 1 in which the seal is an annular seal having an outer surface which is downwardly inclined towards the interior of the chamber.

6. An electrochemical deposition or polishing chamber according to claim 5 in which the annular seal tapers to a sealing surface for sealing against the surface of the substrate.

7. An electrochemical deposition or polishing chamber according to claim 6 in which the sealing surface is an edge region formed at the intersection of two mutually inclined surfaces of the annular seal.

8. An electrochemical deposition or polishing chamber according to claim 5 in which the annular seal is funnel shaped.

9. An electrochemical deposition or polishing chamber according to claim 1 in which, in-use, the seal contacts the substrate at a level, and the slotted opening is disposed less than 5 mm above said level.

10. An electrochemical deposition or polishing chamber according to claim 1 in which the seal is disposed so that, in-use, the seal contacts a peripheral portion of the surface of the substrate which is less than 3 mm from an edge of the substrate.

11. An electrochemical deposition or polishing chamber according to claim 1 in which, when the support is in its in-use position, the separation between the substrate and the electrode is in the range 5 to 30 mm.

Assignees

• Picofluidics Ltd
• Spts Technologies Ltd

Inventors

• Macneil John

Classifications

• C25D21/00 Primary

  Processes for servicing or operating cells for electrolytic coating · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C25D17/004

  Sealing devices · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title