Nozzle for stress-free polishing metal layers on semiconductor wafers

US9724803B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9724803-B2
Application numberUS-201214389540-A
CountryUS
Kind codeB2
Filing dateMar 30, 2012
Priority dateMar 30, 2012
Publication dateAug 8, 2017
Grant dateAug 8, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough. The insulated nozzle head has a cover assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body forming an auxiliary fluid path between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube.

First claim

Opening claim text (preview).

What is claimed is: 1. A nozzle for charging and ejecting electrolyte in stress-free polishing process, comprising: an insulated foundation, defining a through-hole passing therethrough; a conductive body as negative electrode connecting with a power source for charging the electrolyte, the conductive body having a fixing portion located on the insulated foundation, the fixing portion protruding to form a receiving portion inserted into the through-hole of the insulated foundation, the receiving portion defining a receiving hole passing therethrough and the fixing portion; and an insulated nozzle head having a cover stably assembled with the insulated foundation above the conductive body, and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected out for polishing, the tube inserted in the receiving hole and stretching out of the receiving hole of the conductive body, an auxiliary fluid path formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube; wherein the electrolyte is separated into two streams by the tube, one stream of the electrolyte is charged by the conductive body, transported through the main fluid path of the insulated nozzle head and ejected out for polishing, the other stream of the electrolyte is charged by the conductive body, transported through the auxiliary fluid path and recycled without being ejected; wherein the charged electrolyte in the main fluid path and in the auxiliary fluid path are the same. 2. The nozzle as claimed in claim 1 , wherein the insulated foundation defines at least one connecting hole passing therethrough, the fixing portion of the conductive body defines at least one second screw hole; at least one conductive screw is inserted in the second screw hole of the conductive body and further inserted in the connecting hole of the insulated foundation; at least one conductive spring pin is inserted into the connecting hole, one end of the spring pin connects with the conductive screw, the other end of the spring pin connects with the power source to provide electric current to the conductive body for charging the electrolyte. 3. The nozzle as claimed in claim 2 , further comprising at least one insulated sealing ring disposed inside the connecting hole of the insulated foundation to prevent the electrolyte from infiltrating into the connecting hole and eroding the spring pin and the power source. 4. The nozzle as claimed in claim 3 , further comprising at least one plastic protecting sleeve inserted inside the connecting hole of the insulated foundation and surrounding the spring pin. 5. The nozzle as claimed in claim 2 , wherein the insulated foundation has a base portion, the center of the base portion protrudes to form a holding portion, the through-hole and the connecting hole are respectively defined on the holding portion and pass through the entire of the insulated foundation. 6. The nozzle as claimed in claim 5 , wherein the holding portion defines hollow locking portions around the through-hole, the fixing portion of the conductive body defines fixing holes passing therethrough, the hollow locking portions are received in the fixing holes and pass through the fixing holes. 7. The nozzle as claimed in claim 6 , wherein the cover of the insulated nozzle head defines first screw holes thereon, insulated screws are inserted in the first screw holes and further inserted in the hollow locking portions. 8. The nozzle as claimed in claim 1 , wherein the tube defines a top port thereof as an ejecting port through where the electrolyte is ejected on a wafer, the shape of the ejecting port is one of the following: circular, triangular, square, hexagonal or octagonal. 9. The nozzle as claimed in claim 1 , wherein the insulated nozzle head is made of Propene Polymer (PP) or Polyethylene (PE) or Polyethylene Terephthalate (PET). 10. The nozzle as claimed in claim 1 , wherein the conductive body is made of a material that is conductive, erosion resistant and not reactive with the electrolyte material. 11. The nozzle as claimed in claim 10 , wherein the material is stainless steel or aluminum alloy. 12. A nozzle for charging and ejecting electrolyte in stress-free polishing process, comprising: an insulated foundation, defining a through-hole passing therethrough; a conductive body as negative electrode connecting with a power source for charging the electrolyte, the conductive body having a fixing portion located on the insulated foundation, the fixing portion protruding to form a receiving portion inserted into the through-hole of the insulated foundation, the receiving portion defining a receiving hole passing therethrough and the fixing portion; an insulated nozzle head having a cover stably assembled with the insulated foundation above the conductive body, and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected out for polishing, the tube inserted in the receiving hole and stretching out of the receiving hole of the conductive body, an auxiliary fluid path formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube; wherein the insulated foundation defines at least one connecting hole passing therethrough, the fixing portion of the conductive body defines at least one second screw hole; at least one conductive screw is inserted in the second screw hole of the conductive body and further inserted in the connecting hole of the insulated foundation; and at least one conductive spring pin is inserted into the connecting hole, one end of the spring pin connects with the conductive screw, the other end of the spring pin connects with the power source to provide electric current to the conductive body for charging the electrolyte. 13. The nozzle as claimed in claim 12 , further comprising at least one insulated sealing ring disposed inside the connecting hole of the insulated foundation to prevent the electrolyte from infiltrating into the connecting hole and eroding the spring pin and the power source. 14. The nozzle as claimed in claim 13 , further comprising at least one plastic protecting sleeve inserted inside the connecting hole of the insulated foundation and surrounding the spring pin. 15. The nozzle as claimed in claim 12 , wherein the insulated foundation has a base portion, the center of the base portion protrudes to form a holding portion, the through-hole and the connecting hole are respectively defined on the holding portion and pass through the entire of the insulated foundation. 16. The nozzle as claimed in claim 15 , wherein the holding portion defines hollow locking portions around the through-hole, the fixing portion of the conductive body defines fixing holes passing therethrough, the hollow locking portions are received in the fixing holes and pass through the fixing holes. 17. The nozzle as claimed in claim 16 , wherein the cover of the insulated nozzle head defines first screw holes thereon, insulated screws are inserted in the first screw holes and further inserted in the hollow locking portions. 18. The nozzle as claimed in claim 12 , wherein the tube defines a top port thereof as an ejecting port through where the electrolyte is ejected on a wafer, the shape of the ejecting port is one of the following: circular, triangular, square, hexagonal or octagonal. 19. The nozzle as claimed in claim 12 , wherein the insulated nozzle head is mad

Assignees

Inventors

Classifications

  • B24C5/04Primary

    Nozzles therefor (nozzles in general B05B) · CPC title

  • Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating · CPC title

  • C25F3/30Primary

    of semiconducting materials · CPC title

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Frequently asked questions

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What does patent US9724803B2 cover?
A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion forms a receiving portion…
Who is the assignee on this patent?
Wang Jian, Jin Yinuo, Wang Hui, and 1 more
What technology area does this patent fall under?
Primary CPC classification B24C5/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).