Face-up wafer electrochemical planarization apparatus

Patent metadata

Field	Value
Publication number	US-12090600-B2
Application number	US-202217833422-A
Country	US
Kind code	B2
Filing date	Jun 6, 2022
Priority date	Jun 6, 2022
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. The apparatuses may include a spindle that is positionable over the chuck body. The apparatuses may include an end effector coupled with a lower end of the spindle. The end effector may be conductive. The apparatuses may include an electric contact extending from the chuck body or retaining wall. The apparatuses may include a current source. The current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

First claim

What is claimed is:

1. A substrate electrochemical planarization apparatus, comprising:
a chuck body defining a substrate support surface for supporting a substrate;
a retaining wall extending from the chuck body;
an electrolyte delivery port disposed radially inward of the retaining wall;
a spindle that is positionable over the chuck body;
an end effector coupled with a lower end of the spindle, wherein the end effector is conductive;
an electric contact extending from the chuck body or retaining wall, wherein the electric contact is disposed radially outward of the substrate; and
a current source, wherein the current source is configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

2. The substrate electrochemical planarization apparatus of claim 1 , wherein:
the end effector is characterized by a diameter of less than or about 150 mm.

3. The substrate electrochemical planarization apparatus of claim 1 , wherein:
the spindle is rotatable and laterally translatable relative to the chuck body.

4. The substrate electrochemical planarization apparatus of claim 1 , wherein:
a surface of the end effector facing the substrate support surface is planar.

5. The substrate electrochemical planarization apparatus of claim 1 , wherein:
the retaining wall is annular; and
a diameter of end effector is less than an inner diameter of the retaining wall.

6. The substrate electrochemical planarization apparatus of claim 1 , further comprising:
an electrolyte drainage port positioned within one or both of the chuck body and the retaining wall.

7. The substrate electrochemical planarization apparatus of claim 1 , further comprising:
an edge ring seated on the chuck body.

8. A substrate electrochemical planarization apparatus, comprising:
a chuck body defining a substrate support surface for supporting a substrate;
a retaining wall extending from the chuck body;
a spindle that is positionable over the chuck body;
a rotation drive mechanism coupled with the spindle;
an end effector coupled with a lower end of the spindle;
an electric contact extending from the chuck body or the retaining wall, wherein the electric contact is vertically spaced apart from the substrate; and
a current source, wherein the current source is configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

9. The substrate electrochemical planarization apparatus of claim 8 , wherein:
the end effector comprises a conductive material.

10. The substrate electrochemical planarization apparatus of claim 8 , further comprising:
an edge ring seated on the chuck body, wherein an inner diameter of the edge ring is less than about 5% larger than a diameter of substrate support surface.

11. The substrate electrochemical planarization apparatus of claim 8 , wherein:
the retaining wall is disposed radially outward of the chuck body, the retaining wall being annular; and
a diameter of end effector is less than an inner diameter of the retaining wall.

12. The substrate electrochemical planarization apparatus of claim 8 , wherein the retaining wall is disposed radially outward of the chuck body, the substrate electrochemical planarization apparatus further comprising:
an electrolyte source; and
an electrolyte delivery port fluidly coupled with the electrolyte source, the electrolyte delivery port being disposed radially inward of the retaining wall.

13. The substrate electrochemical planarization apparatus of claim 8 , further comprising:
an optical sensor, the optical sensor being directed at the substrate support surface.

14. The substrate electrochemical planarization apparatus of claim 8 , wherein:
the substrate electrochemical planarization apparatus is disposed within a polishing chamber that comprises a face down polishing station.

Assignees

• Applied Materials Inc

Inventors

• Song Kevin H
• Pang Benedict W

Classifications

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P52/203

  of conductive or resistive materials · CPC title

• C25F3/30

  of semiconducting materials · CPC title

• C25F7/00

  Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title