Shock absorber and method for manufacturing shock absorber
US-12553143-B2 · Feb 17, 2026 · US
Microstructure of the layers, e.g. mixed structure
Microstructure of the layers, e.g. mixed structure · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/615 |
| Official title | {Microstructure of the layers, e.g. mixed structure} |
| Display label | Microstructure of the layers, e.g. mixed structure |
| Total patents | 31 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2018 | 2 |
| 2020 | 1 |
| 2021 | 4 |
| 2022 | 3 |
| 2023 | 9 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods for treating metal nanocrystals and for forming bulk nanostructured metal alloys
US-12522928-B2 · Jan 13, 2026 · US
Nickel phosphorous coating
US-2025341016-A1 · Nov 6, 2025 · US
Silver-plated product and method for producing same
US-12203189-B2 · Jan 21, 2025 · US
Roughened copper foil, copper-clad laminate and printed wiring board
US-12104265-B2 · Oct 1, 2024 · US
Self-Lubricating Coating, Fabrication Method, and Electrical Contact
US-2024263335-A1 · Aug 8, 2024 · US
Nickel phosphorous coating
US-12031226-B2 · Jul 9, 2024 · US
Roughened copper foil, copper-clad laminate and printed wiring board
US-2024175162-A1 · May 30, 2024 · US
CO2 reduction toward methane
US-11993857-B2 · May 28, 2024 · US
Nanotwin copper materials in semiconductor devices
US-11973034-B2 · Apr 30, 2024 · US
Nickel phosphorous coating
US-2023392276-A1 · Dec 7, 2023 · US
Shock absorber and method for manufacturing shock absorber
US-2023313403-A1 · Oct 5, 2023 · US
Silver-plated product and method for producing same
US-2023313402-A1 · Oct 5, 2023 · US
Assembly of an aluminum component and of a press hardened steel part having an alloyed coating comprising silicon, iron, zinc and magnesium, the balance being aluminum
US-11753085-B2 · Sep 12, 2023 · US
Electrodeposited platinum-gold alloy
US-11674234-B1 · Jun 13, 2023 · US
Co2 reduction toward methane
US-2023094781-A1 · Mar 30, 2023 · US
Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods
US-11616040-B2 · Mar 28, 2023 · US
Methods for treating metal nanocrystals and for forming bulk nanostructured metal alloys
US-2023083886-A1 · Mar 16, 2023 · US
Nanotwin copper materials in semiconductor devices
US-2023065426-A1 · Mar 2, 2023 · US
CO2 reduction toward methane
US-11512399-B2 · Nov 29, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/615?
- CPC C25D5/615 is the Cooperative Patent Classification code for “Microstructure of the layers, e.g. mixed structure.”
- How many patents are filed under CPC C25D5/615 (Microstructure of the layers, e.g. mixed structure)?
- Our database includes 31 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/615 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).