US2024175162A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024175162-A1 |
| Application number | US-202218284630-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 17, 2022 |
| Priority date | Mar 29, 2021 |
| Publication date | May 30, 2024 |
| Grant date | — |
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Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and suppression of powdering. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and a sharpness index Rc×Sku of 2.35 or less that is a product of the mean height Rc (μm) and a kurtosis Sku. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc, and Sku is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using an S filter and an L filter.
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1 . A roughened copper foil comprising a roughened surface on at least one side, wherein the roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and wherein the roughened surface has a sharpness index Rc×Sku of 2.35 or less that is a product of the mean height Rc (μm) and a kurtosis Sku, wherein Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc, and Sku is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using an S filter and an L filter. 2 . The roughened copper foil according to claim 1 , wherein the roughened surface has a developed interfacial area ratio Sdr of 15.0% or more and 30.0% or less, wherein Sdr is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using the S filter and the L filter. 3 . The roughened copper foil according to claim 1 , wherein the roughened surface has the mean height Rc of 0.40 μm or more and 0.60 μm or less. 4 . The roughened copper foil according to claim 1 , wherein the roughened surface has an arithmetic mean height Sa of 0.15 μm or more and 0.33 μm or less, wherein Sa is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using the S filter and the L filter. 5 . The roughened copper foil according to claim 1 , wherein the roughened surface has a root mean square height Sq of 0.23 μm or more and 0.40 μm or less, wherein Sq is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using the S filter and the L filter. 6 . The roughened copper foil according to claim 1 , wherein the roughened surface has the mean width RSm of the profile elements of 2.80 μm or more and 6.00 μm or less. 7 . The roughened copper foil according to claim 1 , further comprising a rust proofing layer and/or a silane coupling agent layer on the roughened surface. 8 . The roughened copper foil according to claim 1 , wherein the roughened copper foil is an electrodeposited copper foil, and the roughened surface is present on an electrode side of the electrodeposited copper foil. 9 . A copper-clad laminate comprising the roughened copper foil according to claim 1 . 10 . A printed wiring board comprising the roughened copper foil according to claim 1 .
Use of materials for the {conductive, e.g. } metallic pattern · CPC title
Strips or foils · CPC title
by plating · CPC title
of copper · CPC title
Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title
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