Silver-plated product and method for producing same

Patent metadata

Field	Value
Publication number	US-12203189-B2
Application number	US-202118024403-A
Country	US
Kind code	B2
Filing date	Mar 24, 2021
Priority date	Sep 15, 2020
Publication date	Jan 21, 2025
Grant date	Jan 21, 2025

Abstract

There are provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products, and a method for producing the same. The method comprises the steps of: preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A) 2 /D≥10 (° C. 2 ·dm 2 /A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (° C.) and that the current density during the electroplating is D (A/dm 2 ).

First claim

The invention claimed is:

1. A silver-plated product comprising:
a base material; and
a surface layer of silver which is formed on the base material, the surface layer of silver having an average crystallite size of not greater than 17.25 nm and having a Vickers hardness HV of 100 to 160.

2. A silver-plated product as set forth in claim 1 , wherein said Vickers hardness HV is not higher than 145.

3. A silver-plated product as set forth in claim 1 , wherein said surface layer is made of silver of 95 to 99% by weight.

4. A silver-plated product as set forth in claim 1 , wherein said surface layer contains 0.5 to 2% by weight of carbon.

5. A silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy.

6. A silver-plated product as set forth in claim 1 , wherein an underlying layer of nickel is formed between said base material and said surface layer.

7. A silver-plated product as set forth in claim 1 , wherein said surface layer contains a benzothiazole content.

8. A silver-plated product as set forth in claim 1 , wherein the ratio (C/S) of atomic concentration of carbon to atomic concentration of sulfur in the surface layer is in the range of from 3 to 6, and the ratio (S/N) of atomic concentration of sulfur to atomic concentration of nitrogen in the surface layer is in the range of from 1 to 4.

9. A method for producing a silver-plated product, the method comprising the steps of:
preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and
forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A) 2 /D≥10 (° C. 2 ·dm 2 /A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (° C.) and that the current density during the electroplating is D (A/dm 2 ), thus forming the surface layer of silver having an average crystallite size of not greater than 17.25 nm and having a Vickers hardness HV of 100 to 160.

10. A method for producing a silver-plated product as set forth in claim 9 , wherein the concentration of free cyanide in the silver-plating solution is 3 to 60 g/L.

11. A method for producing a silver-plated product as set forth in claim 9 , wherein the concentration of the benzothiazole content in the silver-plating solution is 2 to 30 g/L.

12. A method for producing a silver-plated product as set forth in claim 9 , wherein a concentration of silver in the silver-plating solution is 15 to 85 g/L.

13. A method for producing a silver-plated product as set forth in claim 9 , wherein said benzothiazole is a mercaptobenzothiazole.

14. A method for producing a silver-plated product as set forth in claim 9 , wherein said derivative of the benzothiazole is an alkali metallic salt of the benzothiazole.

15. A method for producing a silver-plated product as set forth in claim 14 , wherein said alkali metallic salt is a sodium salt.

16. A method for producing a silver-plated product as set forth in claim 9 , wherein said electroplating is carried out at a liquid temperature of 15 to 50° C.

17. A method for producing a silver-plated product as set forth in claim 9 , wherein said electroplating is carried out at a current density of 0.5 to 10 A/dm 2 .

18. A method for producing a silver-plated product as set forth in claim 9 , wherein said base material is made of copper or a copper alloy.

19. A method for producing a silver-plated product as set forth in claim 9 , wherein an underlying layer of nickel is formed between said base material and said surface layer.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Hirai Yutaro
• Arai Kentaro
• Sato Yosuke

Classifications

• C25D5/617

  Crystalline layers · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• C25D5/615

  Microstructure of the layers, e.g. mixed structure · CPC title

• H01H1/02

  characterised by the material thereof {(containing gas-evolving material H01H33/765)} · CPC title

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title